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treewide: Add SPDX license identifier - Makefile/Kconfig Add SPDX license identifiers to all Make/Kconfig files which: - Have no license information of any form These files fall under the project license, GPL v2 only. The resulting SPDX license identifier is: GPL-2.0-only Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2019-05-19 13:07:45 +01:00
the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 15:51:08 +08:00
thermal: Rephrase the Kconfig text for thermal The thermal subsystem may have relied on sysfs in 2008 when it was introduced, but these days the thermal zones will more often than not come from the hardware descriptions and not from sysfs. Drop the "Generic" phrases as well: there are no non-generic drivers that I know of, the thermal framework is by definition generic. Reword a bit and fix some grammar. [ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/ Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org
2020-02-29 21:45:27 +01:00
the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 15:51:08 +08:00
thermal: Rephrase the Kconfig text for thermal The thermal subsystem may have relied on sysfs in 2008 when it was introduced, but these days the thermal zones will more often than not come from the hardware descriptions and not from sysfs. Drop the "Generic" phrases as well: there are no non-generic drivers that I know of, the thermal framework is by definition generic. Reword a bit and fix some grammar. [ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/ Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org
2020-02-29 21:45:27 +01:00
the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 15:51:08 +08:00
thermal: Rephrase the Kconfig text for thermal The thermal subsystem may have relied on sysfs in 2008 when it was introduced, but these days the thermal zones will more often than not come from the hardware descriptions and not from sysfs. Drop the "Generic" phrases as well: there are no non-generic drivers that I know of, the thermal framework is by definition generic. Reword a bit and fix some grammar. [ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/ Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org
2020-02-29 21:45:27 +01:00
the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 15:51:08 +08:00
thermal: Rephrase the Kconfig text for thermal The thermal subsystem may have relied on sysfs in 2008 when it was introduced, but these days the thermal zones will more often than not come from the hardware descriptions and not from sysfs. Drop the "Generic" phrases as well: there are no non-generic drivers that I know of, the thermal framework is by definition generic. Reword a bit and fix some grammar. [ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/ Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org
2020-02-29 21:45:27 +01:00
ACPI: thermal: syntax, spelling, kernel-doc Reviewed-by: Randy Dunlap <randy.dunlap@oracle.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-07 16:55:08 -05:00
thermal: Rephrase the Kconfig text for thermal The thermal subsystem may have relied on sysfs in 2008 when it was introduced, but these days the thermal zones will more often than not come from the hardware descriptions and not from sysfs. Drop the "Generic" phrases as well: there are no non-generic drivers that I know of, the thermal framework is by definition generic. Reword a bit and fix some grammar. [ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/ Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org
2020-02-29 21:45:27 +01:00
thermal/drivers/core: Remove the module Kconfig's option The module support for the thermal subsystem makes little sense: - some subsystems relying on it are not modules, thus forcing the framework to be compiled in - it is compiled in for almost every configs, the remaining ones are a few platforms where I don't see why we can not switch the thermal to 'y'. The drivers can stay in tristate. - platforms need the thermal to be ready as soon as possible at boot time in order to mitigate Usually the subsystems framework are compiled-in and the plugs are as module. Remove the module option. The removal of the module related dead code will come after this patch gets in or is acked. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Guenter Roeck <groeck@chromium.org> For mini2440: Acked-by: Krzysztof Kozlowski <krzk@kernel.org> Acked-by: Paul Burton <paul.burton@mips.com> # MIPS part Acked-by: Robert Jarzmik <robert.jarzmik@free.fr> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2019-04-02 18:12:44 +02:00
thermal: Create CONFIG_THERMAL_HWMON=n A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-24 19:38:56 +02:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal: netlink: Fix compilation error when CONFIG_NET=n When the network is not configured, the netlink is disabled on all the system. The thermal framework assumed the netlink is always opt-in. Fix this by adding a Kconfig option for the netlink notification, defaulting to yes and depending on CONFIG_NET. As the change implies multiple stubs and in order to not pollute the internal thermal header, the thermal_nelink.h has been added and included in the thermal_core.h, so this one regain some kind of clarity. Reported-by: Randy Dunlap <rdunlap@infradead.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20200707090159.1018-1-daniel.lezcano@linaro.org
2020-07-07 11:01:57 +02:00
thermal: Add cooling device's statistics in sysfs This extends the sysfs interface for thermal cooling devices and exposes some pretty useful statistics. These statistics have proven to be quite useful specially while doing benchmarks related to the task scheduler, where we want to make sure that nothing has disrupted the test, specially the cooling device which may have put constraints on the CPUs. The information exposed here tells us to what extent the CPUs were constrained by the thermal framework. The write-only "reset" file is used to reset the statistics. The read-only "time_in_state_ms" file shows the time (in msec) spent by the device in the respective cooling states, and it prints one line per cooling state. The read-only "total_trans" file shows single positive integer value showing the total number of cooling state transitions the device has gone through since the time the cooling device is registered or the time when statistics were reset last. The read-only "trans_table" file shows a two dimensional matrix, where an entry <i,j> (row i, column j) represents the number of transitions from State_i to State_j. This is how the directory structure looks like for a single cooling device: $ ls -R /sys/class/thermal/cooling_device0/ /sys/class/thermal/cooling_device0/: cur_state max_state power stats subsystem type uevent /sys/class/thermal/cooling_device0/power: autosuspend_delay_ms runtime_active_time runtime_suspended_time control runtime_status /sys/class/thermal/cooling_device0/stats: reset time_in_state_ms total_trans trans_table This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and ARM 64-bit Hisilicon hikey960 board running Android. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-04-02 16:26:25 +05:30
thermal/debugfs: Add thermal cooling device debugfs information The thermal framework does not have any debug information except a sysfs stat which is a bit controversial. This one allocates big chunks of memory for every cooling devices with a high number of states and could represent on some systems in production several megabytes of memory for just a portion of it. As the sysfs is limited to a page size, the output is not exploitable with large data array and gets truncated. The patch provides the same information than sysfs except the transitions are dynamically allocated, thus they won't show more events than the ones which actually occurred. There is no longer a size limitation and it opens the field for more debugging information where the debugfs is designed for, not sysfs. The thermal debugfs directory structure tries to stay consistent with the sysfs one but in a very simplified way: thermal/ -- cooling_devices |-- 0 | |-- clear | |-- time_in_state_ms | |-- total_trans | `-- trans_table |-- 1 | |-- clear | |-- time_in_state_ms | |-- total_trans | `-- trans_table |-- 2 | |-- clear | |-- time_in_state_ms | |-- total_trans | `-- trans_table |-- 3 | |-- clear | |-- time_in_state_ms | |-- total_trans | `-- trans_table `-- 4 |-- clear |-- time_in_state_ms |-- total_trans `-- trans_table The content of the files in the cooling devices directory is the same as the sysfs one except for the trans_table which has the following format: Transition Hits 1->0 246 0->1 246 2->1 632 1->2 632 3->2 98 2->3 98 Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> [ rjw: White space fixups, rebase ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2024-01-09 10:41:11 +01:00
thermal: Introduce a debugfs-based testing facility Introduce a facility allowing the thermal core functionality to be exercised in a controlled way in order to verify its behavior, without affecting its regular users noticeably. It is based on the idea of preparing thermal zone templates along with their trip points by writing to files in debugfs. When ready, those templates can be used for registering test thermal zones with the thermal core. The temperature of a test thermal zone created this way can be adjusted via debugfs, which also triggers a __thermal_zone_device_update() call for it. By manipulating the temperature of a test thermal zone, one can check if the thermal core reacts to the changes of it as expected. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Link: https://patch.msgid.link/6065927.lOV4Wx5bFT@rjwysocki.net [ rjw: Fixed ordering of kcalloc() arguments ] [ rjw: Fixed debugfs_create_dir() return value checks ] [ rjw: Fixed two kerneldoc comments ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2024-08-22 17:42:57 +02:00
thermal: core: Add a back up thermal shutdown mechanism orderly_poweroff is triggered when a graceful shutdown of system is desired. This may be used in many critical states of the kernel such as when subsystems detects conditions such as critical temperature conditions. However, in certain conditions in system boot up sequences like those in the middle of driver probes being initiated, userspace will be unable to power off the system in a clean manner and leaves the system in a critical state. In cases like these, the /sbin/poweroff will return success (having forked off to attempt powering off the system. However, the system overall will fail to completely poweroff (since other modules will be probed) and the system is still functional with no userspace (since that would have shut itself off). However, there is no clean way of detecting such failure of userspace powering off the system. In such scenarios, it is necessary for a backup workqueue to be able to force a shutdown of the system when orderly shutdown is not successful after a configurable time period. Reported-by: Nishanth Menon <nm@ti.com> Signed-off-by: Keerthy <j-keerthy@ti.com> Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-04-18 09:59:59 +05:30
thermal: Create CONFIG_THERMAL_HWMON=n A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-24 19:38:56 +02:00
thermal: hide CONFIG_THERMAL_HWMON It's about time to revert 16d752397301b9 ("thermal: Create CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also be running a recent enough version of lm-sensors. Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of dropping it, we keep it but hide it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-07-28 13:48:40 -07:00
thermal: hwmon: move hwmon support to single file In order to improve code organization, this patch moves the hwmon sysfs support to a file named thermal_hwmon. This helps to add extra support for hwmon without scrambling the code. In order to do this move, the hwmon list head is now using its own locking. Before, the list used the global thermal locking. Also, some minor changes in the code were required, as recommended by checkpatch.pl. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-03 15:14:28 -04:00
thermal: Create CONFIG_THERMAL_HWMON=n A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-24 19:38:56 +02:00
thermal: hide CONFIG_THERMAL_HWMON It's about time to revert 16d752397301b9 ("thermal: Create CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also be running a recent enough version of lm-sensors. Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of dropping it, we keep it but hide it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-07-28 13:48:40 -07:00
thermal: hwmon: move hwmon support to single file In order to improve code organization, this patch moves the hwmon sysfs support to a file named thermal_hwmon. This helps to add extra support for hwmon without scrambling the code. In order to do this move, the hwmon list head is now using its own locking. Before, the list used the global thermal locking. Also, some minor changes in the code were required, as recommended by checkpatch.pl. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-03 15:14:28 -04:00
thermal: add support for thermal sensor present on SPEAr13xx machines ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-21 12:55:03 -07:00
thermal: introduce device tree parser This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-03 15:35:39 -04:00
Thermal: Provide option to choose default thermal governor This patch provides option to choose the default thermal governor. If no option is provided, the step_wise governor is selected by default. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-21 14:32:24 +05:30
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
Thermal: Provide option to choose default thermal governor This patch provides option to choose the default thermal governor. If no option is provided, the step_wise governor is selected by default. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-21 14:32:24 +05:30
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
Thermal: Provide option to choose default thermal governor This patch provides option to choose the default thermal governor. If no option is provided, the step_wise governor is selected by default. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-21 14:32:24 +05:30
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
Thermal: Provide option to choose default thermal governor This patch provides option to choose the default thermal governor. If no option is provided, the step_wise governor is selected by default. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-21 14:32:24 +05:30
thermal/governor: Remove deprecated information The userspace governor is still in use on production systems and the deprecating warning is scary. Even if we want to get rid of the userspace governor, it is too soon yet as the alternatives are not yet adopted. Change the deprecated warning by an information message suggesting to switch to the netlink thermal events. Fixes: 0275c9fb0eff ("thermal/core: Make the userspace governor deprecated") Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-04-22 16:10:29 +02:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal: introduce the Power Allocator governor The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-03-02 17:17:19 +00:00
thermal: power_allocator: Fix Kconfig warning When do randbuiding, we got this: WARNING: unmet direct dependencies detected for THERMAL_GOV_POWER_ALLOCATOR Depends on [n]: THERMAL [=y] && ENERGY_MODEL [=n] Selected by [y]: - THERMAL_DEFAULT_GOV_POWER_ALLOCATOR [=y] && <choice> The Kconfig option THERMAL_DEFAULT_GOV_POWER_ALLOCATOR selects the THERMAL_GOV_POWER_ALLOCATOR but this one depends on the ENERGY_MODEL which is not enabled. Make THERMAL_DEFAULT_GOV_POWER_ALLOCATOR depend on THERMAL_GOV_POWER_ALLOCATOR to fix this warning. Suggested-by: Quentin Perret <qperret@google.com> Fixes: a4e893e802e6 ("thermal: cpu_cooling: Migrate to using the EM framework") Signed-off-by: YueHaibing <yuehaibing@huawei.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20191113105313.41616-1-yuehaibing@huawei.com
2019-11-13 18:53:13 +08:00
thermal: introduce the Power Allocator governor The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-03-02 17:17:19 +00:00
thermal: Allow selecting the bang-bang governor as default For many setups the bang-bang governor is exactly what we want. Many ARM SoC-based devices use fans to cool down the entire SoC and that works well only with the bang-bang governor because it uses the hysteresis in order to let the fan run for a while to cool the SoC down below the trip point before switching it off again. The step-wise governor will behave strangely in these situations. It doesn't use the hysteresis, so it can lead to situations where the fan is turned on for only a very brief period and then is switched back off, only to get switched back on again very quickly because the SoC hasn't cooled down very much. Signed-off-by: Thierry Reding <treding@nvidia.com> Link: https://lore.kernel.org/r/20230609124408.3788680-1-thierry.reding@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-06-09 14:44:08 +02:00
Thermal: Provide option to choose default thermal governor This patch provides option to choose the default thermal governor. If no option is provided, the step_wise governor is selected by default. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-21 14:32:24 +05:30
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal: Kconfig: cosmetic fixes Fix typo, finish sentence and add missing dots. Signed-off-by: Luka Perkov <luka@openwrt.org> CC: Randy Dunlap <rdunlap@infradead.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-09-27 20:20:33 +02:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal: Added Bang-bang thermal governor The bang-bang thermal governor uses a hysteresis to switch abruptly on or off a cooling device. It is intended to control fans, which can not be throttled but just switched on or off. Bang-bang cannot be set as default governor as it is intended for special devices only. For those special devices the driver needs to explicitely request it. Cc: Andrew Morton <akpm@linux-foundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Andreas Mohr <andi@lisas.de> Cc: Borislav Petkov <bp@suse.de> Cc: Javi Merino <javi.merino@arm.com> Cc: linux-pm@vger.kernel.org Signed-off-by: Peter Feuerer <peter@piie.net> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-22 17:37:13 +02:00
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal: introduce the Power Allocator governor The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-03-02 17:17:19 +00:00
thermal: cpu_cooling: Migrate to using the EM framework The newly introduced Energy Model framework manages power cost tables in a generic way. Moreover, it supports several types of models since the tables can come from DT or firmware (through SCMI) for example. On the other hand, the cpu_cooling subsystem manages its own power cost tables using only DT data. In order to avoid the duplication of data in the kernel, and in order to enable IPA with EMs coming from more than just DT, remove the private tables from cpu_cooling.c and migrate it to using the centralized EM framework. Doing so should have no visible functional impact for existing users of IPA since: - recent extenstions to the the PM_OPP infrastructure enable the registration of EMs in PM_EM using the DT property used by IPA; - the existing upstream cpufreq drivers marked with the 'CPUFREQ_IS_COOLING_DEV' flag all use the aforementioned PM_OPP infrastructure, which means they all support PM_EM. The only two exceptions are qoriq-cpufreq which doesn't in fact use an EM and scmi-cpufreq which doesn't use DT for power costs. For existing users of cpu_cooling, PM_EM tables will contain the exact same power values that IPA used to compute on its own until now. The only new dependency for them is to compile in CONFIG_ENERGY_MODEL. The case where the thermal subsystem is used without an Energy Model (cpufreq_cooling_ops) is handled by looking directly at CPUFreq's frequency table which is already a dependency for cpu_cooling.c anyway. Since the thermal framework expects the cooling states in a particular order, bail out whenever the CPUFreq table is unsorted, since that is fairly uncommon in general, and there are currently no users of cpu_cooling for this use-case. Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Quentin Perret <qperret@google.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191030151451.7961-5-qperret@google.com
2019-10-30 15:14:51 +00:00
thermal: introduce the Power Allocator governor The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-03-02 17:17:19 +00:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal/drivers/core: Fix typo in the option name Unlike the other options, the cpu cooling option is beginning with a lowercase letter, changing to a uppercase. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2019-04-02 18:12:49 +02:00
thermal: cpu_cooling: introduce of_cpufreq_cooling_register This patch introduces an API to register cpufreq cooling device based on device tree node. The registration via device tree node differs from normal registration due to the fact that it is needed to fill the device_node structure in order to be able to match the cooling devices with trip points. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-12 19:26:45 -04:00
thermal/drivers/Kconfig: Convert the CPU cooling device to a choice The next changes will add a new way to cool down a CPU by injecting idle cycles. With the current configuration, a CPU cooling device is the cpufreq cooling device. As we want to add a new CPU cooling device, let's convert the CPU cooling to a choice giving a list of CPU cooling devices. At this point, there is obviously only one CPU cooling device. There is no functional changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org
2019-12-04 16:39:27 +01:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal: cpu_cooling: update Kconfig entry There is no support for hotplug or any other means of reducing temperature. So, this patch removes these references from Kconfig. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-17 17:12:10 +00:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal: cpu_cooling: update Kconfig entry There is no support for hotplug or any other means of reducing temperature. So, this patch removes these references from Kconfig. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-17 17:12:10 +00:00
thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driver The cpu idle cooling device offers a new method to cool down a CPU by injecting idle cycles at runtime. It has some similarities with the intel power clamp driver but it is actually designed to be more generic and relying on the idle injection powercap framework. The idle injection duration is fixed while the running duration is variable. That allows to have control on the device reactivity for the user experience. An idle state powering down the CPU or the cluster will allow to drop the static leakage, thus restoring the heat capacity of the SoC. It can be set with a trip point between the hot and the critical points, giving the opportunity to prevent a hard reset of the system when the cpufreq cooling fails to cool down the CPU. With more sophisticated boards having a per core sensor, the idle cooling device allows to cool down a single core without throttling the compute capacity of several cpus belonging to the same clock line, so it could be used in collaboration with the cpufreq cooling device. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org
2019-12-19 23:53:16 +01:00
thermal/drivers/Kconfig: Convert the CPU cooling device to a choice The next changes will add a new way to cool down a CPU by injecting idle cycles. With the current configuration, a CPU cooling device is the cpufreq cooling device. As we want to add a new CPU cooling device, let's convert the CPU cooling to a choice giving a list of CPU cooling devices. At this point, there is obviously only one CPU cooling device. There is no functional changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org
2019-12-04 16:39:27 +01:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal: Add devfreq cooling Add a generic thermal cooling device for devfreq, that is similar to cpu_cooling. The device must use devfreq. In order to use the power extension of the cooling device, it must have registered its OPPs using the OPP library. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Ørjan Eide <orjan.eide@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 18:09:30 +01:00
thermal: introduce clock cooling device This patch introduces a new thermal cooling device based on common clock framework. The original motivation to write this cooling device is to be able to cool down thermal zones using clocks that feed co-processors, such as GPUs, DSPs, Image Processing Co-processors, etc. But it is written in a way that it can be used on top of any clock. The implementation is pretty straight forward. The code creates a thermal cooling device based on a pair of a struct device and a clock name. The struct device is assumed to be usable by the OPP layer. The OPP layer is used as source of the list of possible frequencies. The (cpufreq) frequency table is then used as a map from frequencies to cooling states. Cooling states are indexes to the frequency table. The logic sits on top of common clock framework, specifically on clock pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is only allowed when the new rate is within the thermal limit (cooling state -> freq). When a thermal cooling device state transition is requested, the clock is also checked to verify if the current clock rate is within the new thermal limit. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Mike Turquette <mturquette@linaro.org> Cc: Nishanth Menon <nm@ti.com> Cc: Pavel Machek <pavel@ucw.cz> Cc: "Rafael J. Wysocki" <rjw@sisk.pl> Cc: Len Brown <len.brown@intel.com> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-01-06 09:04:18 -04:00
thermal: Add PCIe cooling driver Add a thermal cooling driver to provide path to access PCIe bandwidth controller using the usual thermal interfaces. A cooling device is instantiated for controllable PCIe Ports from the bwctrl service driver. If registering the cooling device fails, allow bwctrl's probe to succeed regardless. As cdev in that case contains IS_ERR() pseudo "pointer", clean that up inside the probe function so the remove side doesn't need to suddenly make an odd looking IS_ERR() check. The thermal side state 0 means no throttling, i.e., maximum supported PCIe Link Speed. Link: https://lore.kernel.org/r/20241018144755.7875-9-ilpo.jarvinen@linux.intel.com Signed-off-by: Ilpo Järvinen <ilpo.jarvinen@linux.intel.com> [bhelgaas: dropped data->cdev test per https://lore.kernel.org/r/ZzRm1SJTwEMRsAr8@wunner.de] Signed-off-by: Bjorn Helgaas <bhelgaas@google.com> Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Acked-by: Rafael J. Wysocki <rafael@kernel.org> # From the cooling device interface perspective
2024-10-18 17:47:54 +03:00
thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation This patch adds support to set the emulated temperature method in thermal zone (sensor). After setting this feature thermal zone may report this temperature and not the actual temperature. The emulation implementation may be based on sensor capability through platform specific handler or pure software emulation if no platform handler defined. This is useful in debugging different temperature threshold and its associated cooling action. Critical threshold's cannot be emulated. Writing 0 on this node should disable emulation. Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-04 00:30:15 +00:00
thermal: add a warning for temperature emulation feature Because this feature is for debuging purposes, it is highly recommended to do not enable this on production systems. This patch adds warnings for system integrators, so that people are aware of this potential security issue. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26 21:38:34 +00:00
thermal: Introduce Amazon's Annapurna Labs Thermal Driver This is a generic thermal driver for simple MMIO sensors, of which amazon,al-thermal is one. This device uses a single MMIO transaction to read the temperature and report it to the thermal subsystem. Signed-off-by: Talel Shenhar <talel@amazon.com> Reviewed-by: David Woodhouse <dwmw@amazon.co.uk> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-04-11 13:22:48 +03:00
thermal: Drop obsolete dependency on COMPILE_TEST Since commit 0166dc11be91 ("of: make CONFIG_OF user selectable"), it is possible to test-build any driver which depends on OF on any architecture by explicitly selecting OF. Therefore depending on COMPILE_TEST as an alternative is no longer needed. It is actually better to always build such drivers with OF enabled, so that the test builds are closer to how each driver will actually be built on its intended target. Building them without OF may not test much as the compiler will optimize out potentially large parts of the code. In the worst case, this could even pop false positive warnings. Dropping COMPILE_TEST here improves the quality of our testing and avoids wasting time on non-existent issues. Signed-off-by: Jean Delvare <jdelvare@suse.de> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-07-31 14:13:52 +02:00
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/thermal/thermal_mmio.o: In function 'thermal_mmio_probe':thermal_mmio.c:(.text+0xe1): undefined reference to `devm_ioremap_resource' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Reported-by: kbuild test robot <lkp@intel.com> Signed-off-by: Talel Shenhar <talel@amazon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-04-29 12:47:36 +03:00
thermal: Introduce Amazon's Annapurna Labs Thermal Driver This is a generic thermal driver for simple MMIO sensors, of which amazon,al-thermal is one. This device uses a single MMIO transaction to read the temperature and report it to the thermal subsystem. Signed-off-by: Talel Shenhar <talel@amazon.com> Reviewed-by: David Woodhouse <dwmw@amazon.co.uk> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-04-11 13:22:48 +03:00
thermal: hisilicon: add new hisilicon thermal sensor driver This patch adds the support for hisilicon thermal sensor, within hisilicon SoC. there will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-20 19:16:37 +08:00
thermal: hisilicon: fix for dependency The thermal driver is standalone driver which is used to enable thermal sensors, so it can be used with any cooling device and should not bind with CPU cooling device driver. This original patch is suggested by Amit Kucheria; so it's to polish the dependency in Kconfig, and remove the dependency with CPU_THERMAL. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-08-31 16:50:16 +08:00
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 10:03:59 +09:00
thermal: hisilicon: fix for dependency The thermal driver is standalone driver which is used to enable thermal sensors, so it can be used with any cooling device and should not bind with CPU cooling device driver. This original patch is suggested by Amit Kucheria; so it's to polish the dependency in Kconfig, and remove the dependency with CPU_THERMAL. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-08-31 16:50:16 +08:00
thermal/drivers/hisi: Do not enable by default during compile testing Enabling the compile test should not cause automatic enabling of all drivers, but only allow to choose to compile them. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://lore.kernel.org/r/20250417074638.81329-1-krzysztof.kozlowski@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-04-17 09:46:37 +02:00
thermal: hisilicon: add new hisilicon thermal sensor driver This patch adds the support for hisilicon thermal sensor, within hisilicon SoC. there will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-20 19:16:37 +08:00
thermal: add imx thermal driver support This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 14:30:44 +08:00
thermal: imx: fix for dependency on cpu-freq The thermal driver is a standalone driver for monitoring SoC temperature by enabling thermal sensor, so it can be enabled even when CONFIG_CPU_FREQ is NOT set. So remove the dependency with CPU_THERMAL. Introduce dummy function of legacy cooling register/unregister to make thermal driver probe successfully when CONFIG_CPU_FREQ is NOT set. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-11-21 05:49:36 +00:00
thermal: imx: add NVMEM dependency The driver now fails to link into vmlinux when CONFIG_NVMEM is a loadable module: drivers/thermal/imx_thermal.o: In function `imx_thermal_probe': imx_thermal.c:(.text+0x360): undefined reference to `nvmem_cell_read_u32' imx_thermal.c:(.text+0x360): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32' imx_thermal.c:(.text+0x388): undefined reference to `nvmem_cell_read_u32' imx_thermal.c:(.text+0x388): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32' This adds a Kconfig dependency to force it to be a module as well when its dependency is loadable. Fixes: 7fe5ba04fcdc ("thermal: imx: Add support for reading OCOTP through nvmem") Signed-off-by: Arnd Bergmann <arnd@arndb.de> Reviewed-by: Leonard Crestez <leonard.crestez@nxp.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-09-18 22:48:16 +02:00
thermal: add imx thermal driver support This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 14:30:44 +08:00
thermal: imx_sc: add i.MX system controller thermal support i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller inside, the system controller is in charge of controlling power, clock and thermal sensors etc.. This patch adds i.MX system controller thermal driver support, Linux kernel has to communicate with system controller via MU (message unit) IPC to get each thermal sensor's temperature, it supports multiple sensors which are passed from device tree, please see the binding doc for details. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com
2020-02-22 08:08:50 +08:00
thermal: Remove COMPILE_TEST for IMX_SC_THERMAL i.MX SCU thermal driver depends on IMX_SCU which does NOT have COMPILE_TEST enabled, so need to remove COMPILE_TEST for i.MX SCU thermal as well. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reported-by: Stephen Rothwell <sfr@canb.auug.org.au> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1583222684-10229-2-git-send-email-Anson.Huang@nxp.com
2020-03-03 16:04:44 +08:00
thermal: imx_sc: add i.MX system controller thermal support i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller inside, the system controller is in charge of controlling power, clock and thermal sensors etc.. This patch adds i.MX system controller thermal driver support, Linux kernel has to communicate with system controller via MU (message unit) IPC to get each thermal sensor's temperature, it supports multiple sensors which are passed from device tree, please see the binding doc for details. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com
2020-02-22 08:08:50 +08:00
thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one sensor for CPU, add support for reading immediate temperature of this sensor. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com
2020-02-29 11:44:20 +08:00
thermal: Add COMPILE_TEST support for i.MX8MM Add COMPILE_TEST support to i.MX8MM thermal driver for better compile testing coverage. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1583509057-8197-1-git-send-email-Anson.Huang@nxp.com
2020-03-06 23:37:37 +08:00
thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one sensor for CPU, add support for reading immediate temperature of this sensor. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com
2020-02-29 11:44:20 +08:00
thermal/drivers/imx91: Add support for i.MX91 thermal monitoring unit Introduce support for the i.MX91 thermal monitoring unit, which features a single sensor for the CPU. The register layout differs from other chips, necessitating the creation of a dedicated file for this. This sensor provides a resolution of 1/64°C (6-bit fraction). For actual accuracy, refer to the datasheet, as it varies depending on the chip grade. Provide an interrupt for end of measurement and threshold violation and Contain temperature threshold comparators, in normal and secure address space, with direction and threshold programmability. Datasheet Link: https://www.nxp.com/docs/en/data-sheet/IMX91CEC.pdf Signed-off-by: Pengfei Li <pengfei.li_1@nxp.com> Signed-off-by: Peng Fan <peng.fan@nxp.com> Signed-off-by: Frank Li <Frank.Li@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://patch.msgid.link/20251020-imx91tmu-v7-2-48d7d9f25055@nxp.com
2025-10-20 15:00:41 -04:00
thermal: k3: Add support for bandgap sensors Add VTM thermal support. In the Voltage Thermal Management Module(VTM), K3 AM654 supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Currently reading temperatures only is supported. There are no active/passive cooling agent supported. Signed-off-by: Keerthy <j-keerthy@ti.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com
2020-04-07 11:21:14 +05:30
thermal: max77620: Add thermal driver for reporting junction temp Maxim Semiconductor Max77620 supports alarm interrupts when its die temperature crosses 120C and 140C. These threshold temperatures are not configurable. Add thermal driver to register PMIC die temperature as thermal zone sensor and capture the die temperature warning interrupts to notifying the client. Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-08-23 13:50:27 +05:30
thermal: qoriq: Add thermal management support This driver add thermal management support by enabling TMU (Thermal Monitoring Unit) on QorIQ platform. It's based on thermal of framework: - Trip points defined in device tree. - Cpufreq as cooling device registered in qoriq cpufreq driver. Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-06-30 11:08:38 +08:00
thermal: qoriq: Add platform dependencies The QorIQ Thermal Monitoring Unit is only present on Freescale E500MC and Layerscape SoCs, and on NXP i.MX8 SoCs. Add platform dependencies to the QORIQ_THERMAL config symbol, to avoid asking the user about it when configuring a kernel without support for any of the aforementioned SoCs. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Arnd Bergmann <arnd@arndb.de> Acked-by: Li Yang <leoyang.li@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200507112955.23520-5-geert+renesas@glider.be
2020-05-07 13:29:55 +02:00
thermal: qoriq: Fix a compiling issue Qoriq thermal driver is used by both PowerPC and ARM architecture. When built for PowerPC architecture, it reports error: undefined reference to `.__devm_regmap_init_mmio_clk' To fix it, select config REGMAP_MMIO. Fixes: 4316237bd627 (thermal: qoriq: Convert driver to use regmap API) Signed-off-by: Yuantian Tang <andy.tang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200303084641.35687-1-andy.tang@nxp.com
2020-03-03 16:46:41 +08:00
thermal: qoriq: Add thermal management support This driver add thermal management support by enabling TMU (Thermal Monitoring Unit) on QorIQ platform. It's based on thermal of framework: - Trip points defined in device tree. - Cpufreq as cooling device registered in qoriq cpufreq driver. Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-06-30 11:08:38 +08:00
thermal/drivers: Add support for Airoha EN7581 thermal sensor Add support for Airoha EN7581 thermal sensor. This provide support for reading the CPU or SoC Package sensor and to setup trip points for hot and critical condition. An interrupt is fired to react on this and doesn't require passive poll to read the temperature. The thermal regs provide a way to read the ADC value from an external register placed in the Chip SCU regs. Monitor will read this value and fire an interrupt if the trip condition configured is reached. The Thermal Trip and Interrupt logic is conceptually similar to Mediatek LVTS Thermal but differ in register mapping and actual function/bug workaround. The implementation only share some register names but from functionality observation it's very different and used only for the basic function of periodically poll the temp and trip the interrupt. Signed-off-by: Christian Marangi <ansuelsmth@gmail.com> Link: https://lore.kernel.org/r/20250511185003.3754495-2-ansuelsmth@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-05-11 20:49:55 +02:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal: allow spear-thermal driver to be a module When the thermal subsystem is a loadable module, the spear driver fails to build: drivers/thermal/built-in.o: In function `spear_thermal_exit': spear_thermal.c:(.text+0xf8): undefined reference to `thermal_zone_device_unregister' drivers/thermal/built-in.o: In function `spear_thermal_probe': spear_thermal.c:(.text+0x230): undefined reference to `thermal_zone_device_register' This changes the symbol to a tristate, so Kconfig can track the dependency correctly. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-01-25 17:44:11 +01:00
thermal: spear: allow compile test Adding COMPILE_TEST flag to spear driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-09 20:42:01 -07:00
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 10:03:59 +09:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal: Kconfig: cosmetic fixes Fix typo, finish sentence and add missing dots. Signed-off-by: Luka Perkov <luka@openwrt.org> CC: Randy Dunlap <rdunlap@infradead.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-09-27 20:20:33 +02:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40 This patch adds the support for allwinner thermal sensor, within allwinner SoC. It will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Yangtao Li <tiny.windzz@gmail.com> Signed-off-by: Ondrej Jirman <megous@megous.com> Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com> Acked-by: Maxime Ripard <mripard@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com
2019-12-19 09:28:17 -08:00
thermal: rockchip: add driver for thermal Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 12:58:59 +08:00
thermal: rockchip: allow compile test Adding COMPILE_TEST flag to rockchip driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Heiko Stuebner <heiko@sntech.de> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-rockchip@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-09 20:43:57 -07:00
thermal: rockchip: add driver for thermal Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 12:58:59 +08:00
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 10:03:59 +09:00
thermal: rockchip: add driver for thermal Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 12:58:59 +08:00
thermal: Add support for the thermal sensor on Kirkwood SoCs This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 06:35:24 +00:00
thermal: kirkwood: allow compile test Adding COMPILE_TEST flag to kirkwood driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-09 20:44:46 -07:00
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 10:03:59 +09:00
thermal: Add support for the thermal sensor on Kirkwood SoCs This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 06:35:24 +00:00
Thermal: Dove: Add Themal sensor support for Dove. The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 06:35:26 +00:00
thermal: dove: allow compile test Adding COMPILE_TEST flag to dove driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-09 20:45:25 -07:00
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 10:03:59 +09:00
Thermal: Dove: Add Themal sensor support for Dove. The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 06:35:26 +00:00
Thermal: Add ST-Ericsson DB8500 thermal driver. This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 18:56:42 +08:00
thermal: allow u8500-thermal driver to be a module When the thermal subsystem is a loadable module, the u8500 driver fails to build: drivers/thermal/built-in.o: In function `db8500_thermal_probe': db8500_thermal.c:(.text+0x96c): undefined reference to `thermal_zone_device_register' drivers/thermal/built-in.o: In function `db8500_thermal_work': db8500_thermal.c:(.text+0xab4): undefined reference to `thermal_zone_device_update' This changes the symbol to a tristate, so Kconfig can track the dependency correctly. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-01-25 17:44:12 +01:00
thermal: db8500: Finalize device tree conversion At some point there was an attempt to convert the DB8500 thermal sensor to device tree: a probe path was added and the device tree was augmented for the Snowball board. The switchover was never completed: instead the thermal devices came from from the PRCMU MFD device and the probe on the Snowball was confused as another set of configuration appeared from the device tree. Move over to a device-tree only approach, as we fixed up the device trees. Cc: Vincent Guittot <vincent.guittot@linaro.org> Acked-by: Lee Jones <lee.jones@linaro.org> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Linus Walleij <linus.walleij@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-08-28 15:03:18 +02:00
Thermal: Add ST-Ericsson DB8500 thermal driver. This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 18:56:42 +08:00
thermal: Add driver for Armada 370/XP SoC thermal management This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 01:37:41 +00:00
thermal: armada: Update Kconfig and module description Update Armada thermal driver Kconfig entry as well as the driver's MODULE_DESCRIPTION content, now that 64-bit SoCs are also supported, eg. Armada 7K and Armada 8K. Use the generic term "Marvell EBU Armada SoCs" instead of listing all the supported SoCs everywhere (excepted in the Kconfig description, where it is useful to have a list). Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com> Reviewed-by: Gregory CLEMENT <gregory.clement@free-electrons.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-12-22 17:14:10 +01:00
thermal: armada: allow compile test Adding COMPILE_TEST flag to armada driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-09 20:48:00 -07:00
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 10:03:59 +09:00
thermal: Add driver for Armada 370/XP SoC thermal management This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 01:37:41 +00:00
thermal: armada: Update Kconfig and module description Update Armada thermal driver Kconfig entry as well as the driver's MODULE_DESCRIPTION content, now that 64-bit SoCs are also supported, eg. Armada 7K and Armada 8K. Use the generic term "Marvell EBU Armada SoCs" instead of listing all the supported SoCs everywhere (excepted in the Kconfig description, where it is useful to have a list). Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com> Reviewed-by: Gregory CLEMENT <gregory.clement@free-electrons.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-12-22 17:14:10 +01:00
thermal: Add driver for Armada 370/XP SoC thermal management This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 01:37:41 +00:00
thermal: da9062/61: Thermal junction temperature monitoring driver Add junction temperature monitoring supervisor device driver, compatible with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added. If the PMIC's internal junction temperature rises above T_WARN (125 degC) an interrupt is issued. This T_WARN level is defined as the THERMAL_TRIP_HOT trip-wire inside the device driver. The thermal triggering mechanism is interrupt based and happens when the temperature rises above a given threshold level. The component cannot return an exact temperature, it only has knowledge if the temperature is above or below a given threshold value. A status bit must be polled to detect when the temperature falls below that threshold level again. A kernel work queue is configured to repeatedly poll and detect when the temperature falls below this trip-wire, between 1 and 10 second intervals (defaulting at 3 seconds). This scheme is provided as an example. It would be expected that any final implementation will also include a notify() function and any of these settings could be altered to match the application where appropriate. When over-temperature is reached, the interrupt from the DA9061/2 will be repeatedly triggered. The IRQ is therefore disabled when the first over-temperature event happens and the status bit is polled using a work-queue until it becomes false. This strategy is designed to allow the periodic transmission of uevents (HOT trip point) as the first level of temperature supervision method. It is intended for non-invasive temperature control, where the necessary measures for cooling the system down are left to the host software. Once the temperature falls again, the IRQ is re-enabled so a new critical over-temperature event can be detected. Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-28 15:43:33 +01:00
thermal/drivers/mediatek: Relocate driver to mediatek folder Add MediaTek proprietary folder to upstream more thermal zone and cooler drivers, relocate the original thermal controller driver to it, and rename it as "auxadc_thermal.c" to show its purpose more clearly. Signed-off-by: Balsam CHIHI <bchihi@baylibre.com> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-09 11:56:23 +01:00
thermal: Add Mediatek thermal controller support This adds support for the Mediatek thermal controller found on MT8173 and likely other SoCs. The controller is a bit special. It does not have its own ADC, instead it controls the on-SoC AUXADC via AHB bus accesses. For this reason we need the physical address of the AUXADC. Also it controls a mux using AHB bus accesses, so we need the APMIXEDSYS physical address aswell. Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-11-30 12:42:32 +01:00
thermal: amlogic: Add thermal driver to support G12 SoCs Amlogic G12A and G12B SoCs integrate two thermal sensors with the same design. One is located close to the DDR controller and the other one is located close to the PLLs (between the CPU and GPU). The calibration data for each of the thermal sensors instance is stored in a different location within the AO region. Implement reading the temperature from each thermal sensor. The IP block has more functionality, which may be added to this driver in the future: - chip reset when the temperature exceeds a configurable threshold - up to four interrupts when the temperature has risen above a configurable threshold - up to four interrupts when the temperature has fallen below a configurable threshold Tested-by: Christian Hewitt <christianshewitt@gmail.com> Tested-by: Kevin Hilman <khilman@baylibre.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Guillaume La Roque <glaroque@baylibre.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com
2019-10-04 11:01:09 +02:00
drivers: thermal: Move various drivers for intel platforms into a subdir This cleans up the directory a bit, now that we have several other platforms using platform-specific sub-directories. Compile-tested with ARCH=x86 defconfig and the drivers explicitly enabled with menuconfig. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-12-07 12:25:26 +05:30
thermal: broadcom: add Northstar thermal driver Northstar is a SoC family commonly used in home routers. This commit adds a driver for checking CPU temperature. As Northstar Plus seems to also have this IP block this new symbol gets ARCH_BCM_IPROC dependency. Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Signed-off-by: Jon Mason <jon.mason@broadcom.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-03 17:48:29 +02:00
thermal: broadcom: Add Stingray thermal driver Stingray SoC has six temperature sensor and those are configured, controlled and accessed to read temperature and update in DDR memory using m0 firmware. All six sensors has been given 4 bytes of memory in DDR to write temperature in millivolts. This thermal driver read temperature values from DDR because no direct access to sensors. Like this all temparature sensors are monitored and trips at critical temperature. If driver can't handle thermal runaways because of any unknown reason, then firmware in m0 Processor will handle. Reviewed-by: Ray Jui <ray.jui@broadcom.com> Reviewed-by: Scott Branden <scott.branden@broadcom.com> Reviewed-by: Vikram Prakash <vikram.prakash@broadcom.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Pramod Kumar <pramod.kumar@broadcom.com> Signed-off-by: Srinath Mannam <srinath.mannam@broadcom.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-01-03 14:25:33 +05:30
thermal: broadcom: add Northstar thermal driver Northstar is a SoC family commonly used in home routers. This commit adds a driver for checking CPU temperature. As Northstar Plus seems to also have this IP block this new symbol gets ARCH_BCM_IPROC dependency. Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Signed-off-by: Jon Mason <jon.mason@broadcom.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-03 17:48:29 +02:00
thermal: introduce TI SoC thermal driver This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-15 15:46:00 +00:00
thermal: ti-soc: Kconfig fix to avoid menu showing wrongly Move the dependencies to menu, so we avoid showing it wrongly. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-omap@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-09 21:13:41 -07:00
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 10:03:59 +09:00
thermal: introduce TI SoC thermal driver This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-15 15:46:00 +00:00
Merge branch 'cpu-package-thermal' of .git into next Conflicts: drivers/thermal/Kconfig drivers/thermal/Makefile
2013-06-18 06:31:26 +08:00
thermal: exynos: Moving exynos thermal files into samsung directory This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 16:20:22 +05:30
thermal: exynos: allow compile test Adding COMPILE_TEST flag to exynos driver to facilitate maintenance. Cc: Lukasz Majewski <l.majewski@samsung.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-samsung-soc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-09 20:53:35 -07:00
thermal: exynos: Moving exynos thermal files into samsung directory This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 16:20:22 +05:30
thermal: sti: Introduce ST Thermal core code This core is shared by both ST's 'memory mapped' and 'system configuration register' based Thermal controllers. Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com> Signed-off-by: Lee Jones <lee.jones@linaro.org> Acked-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-06-05 16:06:55 +01:00
thermal/drivers/sti: Depend on THERMAL_OF subsystem Switch to thermal_of_zone to handle thermal-zones. Replace thermal_zone_device_register() by devm_thermal_of_zone_register() and remove ops st_thermal_get_trip_type, st_thermal_get_trip_temp. Signed-off-by: Raphael Gallais-Pou <rgallaispou@gmail.com> Link: https://lore.kernel.org/r/20240716-thermal-v4-2-947b327e165c@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-16 19:34:52 +02:00
thermal: sti: Introduce ST Thermal core code This core is shared by both ST's 'memory mapped' and 'system configuration register' based Thermal controllers. Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com> Signed-off-by: Lee Jones <lee.jones@linaro.org> Acked-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-06-05 16:06:55 +01:00
thermal/drivers/renesas: Group all renesas thermal drivers together Move all Renesas thermal drivers to a vendor specific directory. All drivers are moved verbatim apart from the updated include path for thermal_hwmon.h. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20240506154011.344324-2-niklas.soderlund+renesas@ragnatech.se
2024-05-06 17:40:10 +02:00
thermal: tegra: move tegra thermal files into tegra directory Move Tegra soctherm driver to tegra directory, it's easy to maintain and add more new function support for Tegra platforms. This will also help to split soctherm driver into common parts and chip specific data related parts. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-29 18:29:11 +08:00
thermal: generic-adc: Add ADC based thermal sensor driver In some of platform, thermal sensors like NCT thermistors are connected to the one of ADC channel. The temperature is read by reading the voltage across the sensor resistance via ADC. Lookup table for ADC read value to temperature is referred to get temperature. ADC is read via IIO framework. Add support for thermal sensor driver which read the voltage across sensor resistance from ADC through IIO framework. Acked-by: Jonathan Cameron <jic23@kernel.org> Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-04-19 12:52:01 +05:30
thermal: qcom: tsens: Add a skeletal TSENS drivers TSENS is Qualcomms' thermal temperature sensor device. It supports reading temperatures from multiple thermal sensors present on various QCOM SoCs. Calibration data is generally read from a non-volatile memory (eeprom) device. Add a skeleton driver with all the necessary abstractions so a variety of qcom device families which support TSENS can add driver extensions. Also add the required device tree bindings which can be used to describe the TSENS device in DT. Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org> Reviewed-by: Lina Iyer <lina.iyer@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-05-05 14:21:39 +05:30
thermal: uniphier: add UniPhier thermal driver Add a thermal driver for on-chip PVT (Process, Voltage and Temperature) monitoring unit implemented on UniPhier SoCs. This driver supports temperature monitoring and alert function. Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-01 17:04:51 +09:00
thermal: sprd: Add Spreadtrum thermal driver support This patch adds the support for Spreadtrum thermal sensor controller, which can support maximum 8 sensors. Signed-off-by: Freeman Liu <freeman.liu@unisoc.com> Co-developed-with: Baolin Wang <baolin.wang@unisoc.com> Signed-off-by: Baolin Wang <baolin.wang7@gmail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/ebeb2839cff4d4027b37e787427c5af0e11880c8.1582013101.git.baolin.wang7@gmail.com
2020-02-18 16:10:28 +08:00
thermal: Add support for the MCU controlled FAN on Khadas boards The new Khadas VIM2 and VIM3 boards controls the cooling fan via the on-board microcontroller. This implements the FAN control as thermal devices and as cell of the Khadas MCU MFD driver. Signed-off-by: Neil Armstrong <narmstrong@baylibre.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Lee Jones <lee.jones@linaro.org>
2020-06-24 18:15:27 +02:00
thermal: Drop obsolete dependency on COMPILE_TEST Since commit 0166dc11be91 ("of: make CONFIG_OF user selectable"), it is possible to test-build any driver which depends on OF on any architecture by explicitly selecting OF. Therefore depending on COMPILE_TEST as an alternative is no longer needed. It is actually better to always build such drivers with OF enabled, so that the test builds are closer to how each driver will actually be built on its intended target. Building them without OF may not test much as the compiler will optimize out potentially large parts of the code. In the worst case, this could even pop false positive warnings. Dropping COMPILE_TEST here improves the quality of our testing and avoids wasting time on non-existent issues. Signed-off-by: Jean Delvare <jdelvare@suse.de> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-07-31 14:13:52 +02:00
thermal: Add support for the MCU controlled FAN on Khadas boards The new Khadas VIM2 and VIM3 boards controls the cooling fan via the on-board microcontroller. This implements the FAN control as thermal devices and as cell of the Khadas MCU MFD driver. Signed-off-by: Neil Armstrong <narmstrong@baylibre.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Lee Jones <lee.jones@linaro.org>
2020-06-24 18:15:27 +02:00
thermal/drivers/loongson-2: Add thermal management support This patch adds the support for Loongson-2 thermal sensor controller, which can support maximum four sensor selectors that corresponding to four sets of thermal control registers and one set of sampling register. The sensor selector can selector a speific thermal sensor as temperature input. The sampling register is used to obtain the temperature in real time, the control register GATE field is used to set the threshold of high or low temperature, when the input temperature is higher than the high temperature threshold or lower than the low temperature threshold, an interrupt will occur. Signed-off-by: zhanghongchen <zhanghongchen@loongson.cn> Signed-off-by: Yinbo Zhu <zhuyinbo@loongson.cn> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230817021007.10350-1-zhuyinbo@loongson.cn
2023-08-17 10:10:06 +08:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00