thermal: core: Clean up trip bind/unbind functions

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Make thermal_bind_cdev_to_trip() take a struct cooling_spec pointer
to reduce the number of its arguments, change the return type of
thermal_unbind_cdev_from_trip() to void and rearrange the code in
thermal_zone_cdev_binding() to reduce the indentation level.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Huisong Li <lihuisong@huawei.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://patch.msgid.link/1831773.TLkxdtWsSY@rjwysocki.net
[ rjw: Changed the name of a new function argument ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

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This commit is contained in:

Rafael J. Wysocki 2024-08-21 17:26:28 +02:00

parent c579286a51

commit 18749317d1

1 changed files with 21 additions and 33 deletions

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drivers/thermal/thermal_core.c

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