thermal: ti-soc-thermal: remove external heat while extrapolating hotspot

Browse source

For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.

This patch changes the extrapolation computation to consider
an external sensor in the extrapolation equations.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

...

This commit is contained in:

Eduardo Valentin 2013-05-29 15:07:41 +00:00 • committed by Zhang Rui

parent 0c1569590a

commit 359836e1de

1 changed files with 20 additions and 10 deletions

Show all changes Ignore whitespace when comparing lines Ignore changes in amount of whitespace Ignore changes in whitespace at EOL

Download patch file Download diff file Expand all files Collapse all files

30

drivers/thermal/ti-soc-thermal/ti-thermal-common.c

View file