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usb: musb: introduce DA8xx/OMAP-L1x glue layer

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Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.

Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
This commit is contained in:
Sergei Shtylyov 2010-09-24 13:44:03 +03:00 • committed by Greg Kroah-Hartman
commit 3ee076dea6
4 changed files with 478 additions and 1 deletions
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