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ASoC: SOF: Intel: start splitting top-level from common parts

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The existing code relies on the 'HDA_COMMON' module and namespace. We
need to start splitting top-level parts from the low-level ones,
otherwise we will not be able to reuse the low-level parts DMA support
for SoundWire/BPT.

In the end the dependencies will be:

         +----------------------------------------------+
         |                                              |
         |                                              v
sof-pci-intel-xxx --> sof-intel-hda ------------> sof-hda-common
                          |                             ^
                          |                             |
                          +-> soundwire_intel --> sof_hda_sdw_bpt

This patch adds the initial split between the sof-pci-intel-xxx
modules and the common parts, in a follow-up patch we will further
split the HDA_COMMON parts

Since the PCI modules are not all independent, i.e. the CNL parts are
also used in JSL and TGL, additional Kconfig and namespace modules
were added.

Signed-off-by: Pierre-Louis Bossart <pierre-louis.bossart@linux.intel.com>
Reviewed-by: Bard Liao <yung-chuan.liao@linux.intel.com>
Reviewed-by: Ranjani Sridharan <ranjani.sridharan@linux.intel.com>
Link: https://lore.kernel.org/r/20240503135221.229202-4-pierre-louis.bossart@linux.intel.com
Signed-off-by: Mark Brown <broonie@kernel.org>
This commit is contained in:
Pierre-Louis Bossart 2024-05-03 08:52:17 -05:00 • committed by Mark Brown
commit 456644cbea
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