hwmon: (max6650) add thermal cooling device capability

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This allows max6650 devices to be referenced in dts as a cooling device.

The pwm value seems duplicated in cooling_dev_state but since pwm goes
through rounding logic into data->dac, it is modified and messes with
the thermal zone state algorithms. It's also better to serve a cache
value, thus avoiding periodic actual i2c traffic.

Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>

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Jean-Francois Dagenais 2019-04-18 20:57:22 -04:00 • committed by Guenter Roeck

parent 023912dbb8

commit 4f8d374b77

2 changed files with 90 additions and 1 deletions

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1

drivers/hwmon/Kconfig

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90

drivers/hwmon/max6650.c

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