Thermal: Update binding logic based on platform data

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This patch updates the binding logic in thermal_sys.c
It uses the platform layer data to bind a thermal zone
to a cdev for a particular trip point.

 * If we do not have platform data and do not have
   .bind defined, do not bind.
 * If we do not have platform data but .bind is
   defined, then use tz->ops->bind.
 * If we have platform data, use it to create binding.

The same logic sequence is followed for unbind also.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

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Durgadoss R 2012-09-18 11:04:59 +05:30 • committed by Zhang Rui

parent 5a2c090b33

commit 7e8ee1e9d7

1 changed files with 157 additions and 26 deletions

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drivers/thermal/thermal_sys.c

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