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dt-bindings: thermal: qcom-tsens: Document the Maili Temperature Sensor
Document the Temperature Sensor (TSENS) on the Qualcomm Maili SoC. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Signed-off-by: Haritha S K <haritha.k@oss.qualcomm.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org> Link: https://patch.msgid.link/20260619-b4-maili-upstream-3-v2-1-e54516c37022@oss.qualcomm.com
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