ARM: dts: omap3: Add support for IGEP COM Module

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ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.

This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.

Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>

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Javier Martinez Canillas 2012-12-19 14:33:10 +01:00 • committed by Benoit Cousson

parent cb5e191e96

commit 9ad1df2b15

2 changed files with 45 additions and 0 deletions

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1

arch/arm/boot/dts/Makefile

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44

arch/arm/boot/dts/omap3-igep0030.dts

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