ACPICA: Fixed a memory leak when Device or Thermal objects referenced in packages

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Problem introduced in fix for Package references.

Signed-off-by: Bob Moore <robert.moore@intel.com>
Signed-off-by: Alexey Starikovskiy <astarikovskiy@suse.de>
Signed-off-by: Len Brown <len.brown@intel.com>

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Bob Moore 2008-04-10 19:06:39 +04:00 • committed by Len Brown

parent 7f4ac9f913

commit 9e41d93c97

2 changed files with 26 additions and 20 deletions

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38

drivers/acpi/dispatcher/dsobject.c

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8

drivers/acpi/utilities/utdelete.c

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