thermal: core: Update thermal zones after cooling device binding

Browse source

If a new cooling device is registered and it is bound to at least one
trip point in a given thermal zone, that thermal zone needs to be
updated via __thermal_zone_device_update().

Instead of doing this with the help of the need_update atomic field in
struct thermal_zone_device, which is not particularly straightforward,
make __thermal_zone_cdev_bind() return a bool value indicating whether
or not the given thermal zone needs to be updated because a new cooling
device has been bound to it and update thermal_zone_cdev_bind() to
call __thermal_zone_device_update() when this value is "true".

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/2226302.Icojqenx9y@rjwysocki.net
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>

...

This commit is contained in:

Rafael J. Wysocki 2024-10-04 21:33:28 +02:00

parent fa4f9c9679

commit c4cd42ebd3

1 changed files with 13 additions and 10 deletions

Show all changes Ignore whitespace when comparing lines Ignore changes in amount of whitespace Ignore changes in whitespace at EOL

Download patch file Download diff file Expand all files Collapse all files

23

drivers/thermal/thermal_core.c

View file