Insert exynos5 TMU sensor changes into the thermal driver. Some exynos4
changes are made generic for exynos series.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: SangWook Ju <sw.ju@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms. As a proof of concept, we have
drivers for the following platforms using this mechanism now:
* Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
* Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)
There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.
Brief Description:
1) The generic cooling devices code is placed inside driver/thermal/*
as placing inside acpi folder will need un-necessary enabling of acpi
code. This code is architecture independent.
2) This patchset adds generic cpu cooling low level implementation
through frequency clipping. In future, other cpu related cooling
devices may be added here. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c) .But this will be useful for
platforms like ARM using the generic thermal interface along with the
generic cpu cooling devices. The cooling device registration API's
return cooling device pointers which can be easily binded with the
thermal zone trip points. The important APIs exposed are,
a) struct thermal_cooling_device *cpufreq_cooling_register(
struct cpumask *clip_cpus)
b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
3) Samsung exynos platform thermal implementation is done using the
generic cpu cooling APIs and the new trip type. The temperature sensor
driver present in the hwmon folder(registered as hwmon driver) is moved
to thermal folder and registered as a thermal driver.
A simple data/control flow diagrams is shown below,
Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor
| |
\|/ |
Cpufreq cooling device <---------------
TODO:
*Will send the DT enablement patches later after the driver is merged.
This patch:
Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The type parameter in thermal_zone_device_register and
thermal_cooling_device_register can be NULL, indicating that no sysfs attribute
for the type should be created. Only call strlen() and strcpy() on type if it is
not NULL.
This patch addresses Coverity #102180 and #102182: Dereference before null check
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
temp_crit.name and temp_input.name have a length of 16 bytes. Using
THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in
out-of-bounds memory accesses. Replace it with sizeof().
Addresses Coverity #115679
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Cc: Len Brown <lenb@kernel.org>
Cc: "Brown, Len" <len.brown@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.
But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.
With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
of all its instances.
Note that, currently, the cooling device is set to the deepest
cooling state required.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
thermal_instance should be referenced by both thermal zone devices
and thermal cooling devices.
Rename thermal_instance.node to thermal_instance.tz_node in this patch
and thermal_instanace.cdev_node will be introduced in next patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances
thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This struct is used to describe the behavior for a thermal
cooling device on a certain trip point for a certain thremal zone.
thermal_cooling_device_instance is not accurate, as a cooling device
can be used for more than one trip point in one thermal zone device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This function is used to update the cooling state of
all the cooling devices that are bound to an active trip point.
This will be used for passive cooling as well, in the future patches.
as both active and passive cooling can share the same algorithm,
which is
1. if the temperature is higher than a trip point,
a. if the trend is THERMAL_TREND_RAISING, use higher cooling
state for this trip point
b. if the trend is THERMAL_TREND_DROPPING, use lower cooling
state for this trip point
2. if the temperature is lower than a trip point, use lower
cooling state for this trip point.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
According to ACPI spec, tc1 and tc2 are used by OSPM
to anticipate the temperature trends.
We introduced the same concept to the generic thermal layer
for passive cooling, but now it seems that these values
are hard to be used on other platforms.
So We introduce .get_trend() as a more general solution.
For the platform thermal drivers that have their own way to
anticipate the temperature trends, they should provide
their own .get_trend() callback.
Or else, we will calculate the temperature trends by simply
comparing the current temperature and the cached previous
temperature reading.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
set upper and lower limits when binding
a thermal cooling device to a thermal zone device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
As the active cooling devices can have multiple cooling states,
we may want only several cooling states for a certain trip point,
and other cooling states for other active trip points.
To do this, we should be able to describe the cooling device
behavior for a certain trip point, rather than for the entire thermal zone.
And when updating thermal zone, we need to check the upper and lower limit
to make sure the cooling device is set to the proper cooling state.
Note that this patch will not bring any different behavior as
upper limit is set to max_state and lower limit is set to 0
in this patch, for now.
Next patch will set these to real values.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This is because general active cooling devices, like fans,
may have multiple speeds, which can be mapped to different cooling states.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
When either of __alloc_from_contiguous or __alloc_remap_buffer fails
to provide a valid pointer, allocated memory is freed up and an error
is returned. 'pages' was however not freed before returning error.
Cc: Arnd Bergmann <arnd@arndb.de>
Cc: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
commit b17459c050
raid5: add a per-stripe lock
added a spin_lock to the 'stripe_head' struct.
Unfortunately there are two places where this struct is allocated
but the spin lock was only initialised in one of them.
So add the missing spin_lock_init.
Signed-off-by: NeilBrown <neilb@suse.de>
remove existing non-dt code.
-----BEGIN PGP SIGNATURE-----
Version: GnuPG v1.4.11 (GNU/Linux)
iQEcBAABAgAGBQJQXBatAAoJEAKiPfwuf9N/VZoIAI7PKNwakjM/KDiVzytwqZ+U
h9kkjYW4ra8MH+jpjFQqvSyIJ3U+t016xqW3ZbqRuZBDgH0I7Gax7QoAZ/ljPlpG
RAKl2l9WVPiBSwCESTpvR5lafBLklk6fL0Z267qIxDGld6YBiWHvTKIh1zDmeCWW
hgDeWtcb1M61VlPrj9nPnCze66h2dUk+QSxaCodv7co5kzb0Q4S7U64BCs0hGe01
kkdoUwnBjdeK0cUhDAJAP1vRyk04N16+H7yp4npmKhv/blKVc3MIRjg1iBV78ncd
Kke/G1B9TJRpNTXdySYnsDQpaCWNSAryKXKkdxP0gh6MW8CMKYc1mdKYcEP3Tk8=
=xG1+
-----END PGP SIGNATURE-----
Merge tag 'vt8500-for-next' of git://git.code.sf.net/p/linuxwmt/code into next/dt
From Tony Prisk:
Update arch-vt8500 and drivers to device tree and
remove existing non-dt code.
* tag 'vt8500-for-next' of git://git.code.sf.net/p/linuxwmt/code:
arm: vt8500: Update arch-vt8500 to devicetree support.
arm: vt8500: gpio: Devicetree support for arch-vt8500
arm: vt8500: doc: Add device tree bindings for arch-vt8500 devices
arm: vt8500: clk: Add Common Clock Framework support
video: vt8500: Add devicetree support for vt8500-fb and wm8505-fb
serial: vt8500: Add devicetree support for vt8500-serial
rtc: vt8500: Add devicetree support for vt8500-rtc
arm: vt8500: Add device tree files for VIA/Wondermedia SoC's
Resolved add/change conflict in drivers/clk/Makefile.
Signed-off-by: Olof Johansson <olof@lixom.net>
Use regmap_update_bits() to replace regmap_read() + regmap_write().
With this patch, we only show the error message when regmap_update_bits()
fails.
Signed-off-by: Axel Lin <axel.lin@ingics.com>
Acked-by: G.Shark Jeong<gshark.jeong@gmail.com>
Signed-off-by: Bryan Wu <bryan.wu@canonical.com>
This Patch adds support for mcp3221 chip to the
mcp3021 driver.
Signed-off-by: Sven Schuchmann <schuchmann@schleissheimer.de>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
This Patch is to prepare the MCP3021 driver to support
other chips like the MCP3221. The hard defined chip data
is now stored within the data struct of each chip.
Signed-off-by: Sven Schuchmann <schuchmann@schleissheimer.de>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
The following build warnings are seen with -Wextra.
w83791d.c: In function store_temp_target:
w83791d.c:858:2: warning: comparison of unsigned expression < 0 is always false
w83791d.c: In function store_temp_tolerance:
w83791d.c:920:2: warning: comparison of unsigned expression < 0 is always false
For store_temp_target, accept negative numbers and clamp to >= 0.
For store_temp_tolerance, drop the unnecessary comparison.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Jean Delvare <khali@linux-fr.org>
The following build warning is seen with -Wextra.
lm93.c: In function ‘store_fan_smart_tach’:
lm93.c:1833:2: warning: comparison of unsigned expression >= 0 is always true
Drop the unnecessary comparison.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Jean Delvare <khali@linux-fr.org>
Instead of using a switch statement to determine the device name, use
to_spi_device(dev)->modalias to simplify the code and reduce module size.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Display device name using to_spi_device(dev)->modalias instead of computing it
from the number of ADC channels. This is cleaner and reduces code size.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
CONFIG_EXPERIMENTAL is expected to be removed, so drop dependencies on it.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Jean Delvare <khali@linux-fr.org>
Add missing reference to IT8782F and IT8783E/F to it87 driver description
in Kconfig. Replace wrong reference to Si960 with the correct Si950.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Jean Delvare <khali@linux-fr.org>
This patch moves the sht15.h header from include/linux to
include/linux/platform_data, and update existing support (stargate2
platform) accordingly.
Signed-off-by: Vivien Didelot <vivien.didelot@savoirfairelinux.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
The semantic patch that finds this problem is as follows:
(http://coccinelle.lip6.fr/)
// <smpl>
@r exists@
position p1,p2;
expression x;
@@
if (x@p1 == NULL) { ... kfree@p2(x); ... return ...; }
@unchanged exists@
position r.p1,r.p2;
expression e <= r.x,x,e1;
iterator I;
statement S;
@@
if (x@p1 == NULL) { ... when != I(x,...) S
when != e = e1
when != e += e1
when != e -= e1
when != ++e
when != --e
when != e++
when != e--
when != &e
kfree@p2(x); ... return ...; }
@ok depends on unchanged exists@
position any r.p1;
position r.p2;
expression x;
@@
... when != true x@p1 == NULL
kfree@p2(x);
@depends on !ok && unchanged@
position r.p2;
expression x;
@@
*kfree@p2(x);
// </smpl>
Signed-off-by: Peter Senna Tschudin <peter.senna@gmail.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
INA220 is register compatible to INA219, and INA230 is register compatible to
INA226, so all we need to do is to add name aliases for those two chips.
Cc: Lothar Felten <l-felten@ti.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Jean Delvare <khali@linux-fr.org>
Replace per-device initialization and per-device calculation code with
per-device configuration data, which is then used to configure the chip and
perform calculations based on that data.
This patch reduces code size by more than 400 bytes on x86_64.
Cc: Lothar Felten <l-felten@ti.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Jean Delvare <khali@linux-fr.org>
MAX1110 is similar to MAX1111, with 8 instead of 4 channels. MAX1112 and MAX1113
are similar to MAX1110 and MAX1111, with 4.096V reference voltage instead of
2.048V.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Jean Delvare <khali@linux-fr.org>
Add support for LM74 and LM71 to LM70 driver.
Signed-off-by: Christophe Leroy <christophe.leroy@c-s.fr>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Legacy sysfs attributes for chassis intrusion detection have been removed.
Update feature-removal-schedule.txt to reflect it.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Jean Delvare <khali@linux-fr.org>
Removing the 3wire limitation on LM70 as the component also allows
operation on 4wire SPI bus
Signed-off-by: Christophe Leroy <christophe.leroy@c-s.fr>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Declare an array of platform_device_id, instead of registering a driver
for each supported chip. This makes the code cleaner.
Also add a module description.
Signed-off-by: Vivien Didelot <vivien.didelot@savoirfairelinux.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
The MAX197 is an A/D converter, made by Maxim. This driver currently
supports the MAX197, and MAX199. They are both 8-Channel, Multi-Range,
5V, 12-Bit DAS with 8+4 Bus Interface and Fault Protection.
The available ranges for the MAX197 are {0,-5V} to 5V, and {0,-10V} to
10V, while they are {0,-2V} to 2V, and {0,-4V} to 4V on the MAX199.
Signed-off-by: Vivien Didelot <vivien.didelot@savoirfairelinux.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
This patch brings basic support for the Analog Devices ADT7410 temperature
sensor. The following functionality has been implemented:
* get current temperature
* get/set minimum, maximum and critical temperature
* get/set hysteresis
* get alarm events for minimum, maximum and critical temperature
All implemented sysfs attributes have been sucessfully tested at temperatures
of 15°C to 40°C.
Signed-off-by: Hartmut Knaack <knaack.h@gmx.de>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Convert to use devm_ functions to reduce code size and simplify the code.
Cc: Andreas Herrmann <andreas.herrmann3@amd.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Convert to use devm_ functions to reduce code size and simplify the code.
Cc: Lars-Peter Clausen <lars@metafoo.de>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
