On ISP83xx cards perform a fundamental reset instead of hot reset.
Signed-off-by: Joe Carnuccio <joe.carnuccio@qlogic.com>
Signed-off-by: Chad Dupuis <chad.dupuis@qlogic.com>
Signed-off-by: James Bottomley <JBottomley@Parallels.com>
Signed-off-by: Andrew Vasquez <andrew.vasquez@qlogic.com>
Signed-off-by: Chad Dupuis <chad.dupuis@qlogic.com>
Signed-off-by: James Bottomley <JBottomley@Parallels.com>
Signed-off-by: Andrew Vasquez <andrew.vasquez@qlogic.com>
Signed-off-by: Chad Dupuis <chad.dupuis@qlogic.com>
Signed-off-by: James Bottomley <JBottomley@Parallels.com>
Setting this to 255 will cause any target with id 255 to not show up so leave
it at the default in our host template.
Signed-off-by: Andrew Vasquez <andrew.vasquez@qlogic.com>
Signed-off-by: Chad Dupuis <chad.dupuis@qlogic.com>
Signed-off-by: James Bottomley <JBottomley@Parallels.com>
qla2xxx show wrong PCIe(2.5Gb/s x8) speed in the kerenel message. It should be
5.0Gb/s.
Signed-off-by: Atul Deshmukh <atul.deshmukh@qlogic.com>
Signed-off-by: Chad Dupuis <chad.dupuis@qlogic.com>
Signed-off-by: James Bottomley <JBottomley@Parallels.com>
Stale information in the temporary fcport created in
qla2x00_configure_local_loop() causes qla2x00_get_port_database() call
to fail. This reschedules scan, which gets stuck continuously in the
rescheduling-of-scan loop due to the failure.
Signed-off-by: Arun Easi <arun.easi@qlogic.com>
Signed-off-by: Chad Dupuis <chad.dupuis@qlogic.com>
Signed-off-by: James Bottomley <JBottomley@Parallels.com>
Update the driver copyright from 2003-2011 to 2003-2012.
Signed-off-by: Giridhar Malavali <giridhar.malavali@qlogic.com>
Signed-off-by: Chad Dupuis <chad.dupuis@qlogic.com>
Signed-off-by: James Bottomley <JBottomley@Parallels.com>
Minor changes to support loopback functionality with ISP83xx CNAs.
Signed-off-by: Giridhar Malavali <giridhar.malavali@qlogic.com>
Signed-off-by: Chad Dupuis <chad.dupuis@qlogic.com>
Signed-off-by: James Bottomley <JBottomley@Parallels.com>
Signed-off-by: Joe Carnuccio <joe.carnuccio@qlogic.com>
Signed-off-by: Chad Dupuis <chad.dupuis@qlogic.com>
Signed-off-by: James Bottomley <JBottomley@Parallels.com>
Store used fcport loop_id's in a bitmap so that as opposed to looping through
all fcports to find the next free loop_id, new loop_id lookup can be just be
done via bitops.
[jejb: plus fix for incorrect LOOPID_MAP_SIZE from Andrew Vasquez]
Signed-off-by: Giridhar Malavali <giridhar.malavali@qlogic.com>
Signed-off-by: Andrew Vasquez <andrew.vasquez@qlogic.com>
Signed-off-by: Chad Dupuis <chad.dupuis@qlogic.com>
Signed-off-by: James Bottomley <JBottomley@Parallels.com>
Remove 'rx_ring' parameter as it is not used in ixgbevf_receive_skb
Signed-off-by: Narendra K <narendra_k@dell.com>
Acked-by: Greg Rose <gregory.v.rose@intel.com>
Signed-off-by: Jeff Kirsher <jeffrey.t.kirsher@intel.com>
The counter is not valid unless the controller is running in IOV mode.
Signed-off-by: Greg Rose <gregory.v.rose@intel.com>
Tested-by: Phil Schmitt <phillip.j.schmitt@intel.com>
Signed-off-by: Jeff Kirsher <jeffrey.t.kirsher@intel.com>
The VF driver was not designed to correctly handle a message timeout. As
a result it is possible for one bad message to invalidate all messages
following it until the part is reset. Instead we should copy the example
in igbvf of how to handle a mailbox event and message timeout.
Signed-off-by: Alexander Duyck <alexander.h.duyck@intel.com>
Tested-by: Phil Schmitt <phillip.j.schmitt@intel.com>
Signed-off-by: Jeff Kirsher <jeffrey.t.kirsher@intel.com>
devm_* functions are used to replace kzalloc, request_mem_region, ioremap
and request_irq functions in probe call. With the usage of devm_* functions
explicit freeing and unmapping is not required.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Sachin Kamat <sachin.kamat@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add necessary default platform data support needed for TMU driver. The
supplied dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
platforms and only compile tested for exynos4412.
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: jonghwa lee <jonghwa3.lee@samsung.com>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This code added creates a link between temperature sensors, linux thermal
framework and cooling devices for samsung exynos platform. This layer
monitors the temperature from the sensor and informs the generic thermal
layer to take the necessary cooling action.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Insert exynos5 TMU sensor changes into the thermal driver. Some exynos4
changes are made generic for exynos series.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: SangWook Ju <sw.ju@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms. As a proof of concept, we have
drivers for the following platforms using this mechanism now:
* Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
* Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)
There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.
Brief Description:
1) The generic cooling devices code is placed inside driver/thermal/*
as placing inside acpi folder will need un-necessary enabling of acpi
code. This code is architecture independent.
2) This patchset adds generic cpu cooling low level implementation
through frequency clipping. In future, other cpu related cooling
devices may be added here. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c) .But this will be useful for
platforms like ARM using the generic thermal interface along with the
generic cpu cooling devices. The cooling device registration API's
return cooling device pointers which can be easily binded with the
thermal zone trip points. The important APIs exposed are,
a) struct thermal_cooling_device *cpufreq_cooling_register(
struct cpumask *clip_cpus)
b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
3) Samsung exynos platform thermal implementation is done using the
generic cpu cooling APIs and the new trip type. The temperature sensor
driver present in the hwmon folder(registered as hwmon driver) is moved
to thermal folder and registered as a thermal driver.
A simple data/control flow diagrams is shown below,
Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor
| |
\|/ |
Cpufreq cooling device <---------------
TODO:
*Will send the DT enablement patches later after the driver is merged.
This patch:
Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The type parameter in thermal_zone_device_register and
thermal_cooling_device_register can be NULL, indicating that no sysfs attribute
for the type should be created. Only call strlen() and strcpy() on type if it is
not NULL.
This patch addresses Coverity #102180 and #102182: Dereference before null check
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
temp_crit.name and temp_input.name have a length of 16 bytes. Using
THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in
out-of-bounds memory accesses. Replace it with sizeof().
Addresses Coverity #115679
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Cc: Len Brown <lenb@kernel.org>
Cc: "Brown, Len" <len.brown@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.
But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.
With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
of all its instances.
Note that, currently, the cooling device is set to the deepest
cooling state required.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
thermal_instance should be referenced by both thermal zone devices
and thermal cooling devices.
Rename thermal_instance.node to thermal_instance.tz_node in this patch
and thermal_instanace.cdev_node will be introduced in next patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances
thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This struct is used to describe the behavior for a thermal
cooling device on a certain trip point for a certain thremal zone.
thermal_cooling_device_instance is not accurate, as a cooling device
can be used for more than one trip point in one thermal zone device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This function is used to update the cooling state of
all the cooling devices that are bound to an active trip point.
This will be used for passive cooling as well, in the future patches.
as both active and passive cooling can share the same algorithm,
which is
1. if the temperature is higher than a trip point,
a. if the trend is THERMAL_TREND_RAISING, use higher cooling
state for this trip point
b. if the trend is THERMAL_TREND_DROPPING, use lower cooling
state for this trip point
2. if the temperature is lower than a trip point, use lower
cooling state for this trip point.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
