[ Upstream commit 1467fb9603 ]
REGMAP is a hidden (not user visible) symbol. Users cannot set it
directly thru "make *config", so drivers should select it instead of
depending on it if they need it.
Consistently using "select" or "depends on" can also help reduce
Kconfig circular dependency issues.
Therefore, change the use of "depends on REGMAP" to "select REGMAP".
Fixes: b474303ffd ("thermal: add Intel BXT WhiskeyCove PMIC thermal driver")
Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Sasha Levin <sashal@kernel.org>
[ Upstream commit f1b930e740 ]
If alloc_soc_dts() fails, then we can just return. Trying to free
"soc_dts" will lead to an Oops.
Fixes: 8c18769396 ("thermal: intel Quark SoC X1000 DTS thermal driver")
Signed-off-by: Dan Carpenter <error27@gmail.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Sasha Levin <sashal@kernel.org>
commit 8e47363588 upstream.
The powerclamp cooling device cur_state shows actual idle observed by
package C-state idle counters. But the implementation is not sufficient
for multi package or multi die system. The cur_state value is incorrect.
On these systems, these counters must be read from each package/die and
somehow aggregate them. But there is no good method for aggregation.
It was not a problem when explicit CPU model addition was required to
enable intel powerclamp. In this way certain CPU models could have
been avoided. But with the removal of CPU model check with the
availability of Package C-state counters, the driver is loaded on most
of the recent systems.
For multi package/die systems, just show the actual target idle state,
the system is trying to achieve. In powerclamp this is the user set
state minus one.
Also there is no use of starting a worker thread for polling package
C-state counters and applying any compensation for multiple package
or multiple die systems.
Fixes: b721ca0d19 ("thermal/powerclamp: remove cpu whitelist")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 4.14+ <stable@vger.kernel.org> # 4.14+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
[ Upstream commit 40dc192908 ]
Add the PCI ID for the Wellsburg C610 series chipset PCH.
The driver can read the temperature from the Wellsburg PCH with only
the PCI ID added and no other modifications.
Signed-off-by: Tim Zimmermann <tim@linux4.de>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Sasha Levin <sashal@kernel.org>
[ Upstream commit e7fcfe67f9 ]
The return value from the call to intel_tcc_get_tjmax() is int, which can
be a negative error code. However, the return value is being assigned to
an u32 variable 'tj_max', so making 'tj_max' an int.
Eliminate the following warning:
./drivers/thermal/intel/intel_soc_dts_iosf.c:394:5-11: WARNING: Unsigned expression compared with zero: tj_max < 0
Link: https://bugzilla.openanolis.cn/show_bug.cgi?id=3637
Reported-by: Abaci Robot <abaci@linux.alibaba.com>
Signed-off-by: Yang Li <yang.lee@linux.alibaba.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Sasha Levin <sashal@kernel.org>
[ Upstream commit 15cc25829a ]
The commit 74c8e6bffb ("driver core: Add __alloc_size hint to devm
allocators") exposes a panic "BRK handler: Fatal exception" on the
hi3660_thermal_probe funciton.
This is because the function allocates memory for only one
sensors array entry, but tries to fill up a second one.
Fix this by removing the unneeded second access.
Fixes: 7d3a2a2bba ("thermal/drivers/hisi: Fix number of sensors on hi3660")
Signed-off-by: Yongqin Liu <yongqin.liu@linaro.org>
Link: https://lore.kernel.org/linux-mm/20221101223321.1326815-5-keescook@chromium.org/
Link: https://lore.kernel.org/r/20230210141507.71014-1-yongqin.liu@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Sasha Levin <sashal@kernel.org>
[ Upstream commit 4b26b7c9cd ]
The minimal resource ID is 0: IMX_SC_R_AP_0=0, so fix
the loop condition. Aside of this - constify the array.
Fixes: 31fd4b9db1 ("thermal/drivers/imx_sc: Rely on the platform data to get the resource id")
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Dong Aisheng <Aisheng.dong@nxp.com>
Link: https://lore.kernel.org/r/20230117091956.61729-1-viorel.suman@oss.nxp.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Sasha Levin <sashal@kernel.org>
[ Upstream commit 903238a33c ]
On msm8939 last (hwid=10) sensor was added in the hw revision 3.0.
Calibration data for it was placed outside of the main calibration data
blob, so it is not accessible by the current blob-parsing code.
Moreover data for the sensor's p2 is not contiguous in the fuses. This
makes it hard to use nvmem_cell API to parse calibration data in a
generic way.
Since the sensor doesn't seem to be actually used by the existing
hardware, disable the sensor for now.
Fixes: 332bc8ebab ("thermal: qcom: tsens-v0_1: Add support for MSM8939")
Cc: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Cc: Shawn Guo <shawn.guo@linaro.org>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-9-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Sasha Levin <sashal@kernel.org>
[ Upstream commit a7d3006be5 ]
Tsens driver mentions that msm8976 data should be used for both msm8976
and msm8956 SoCs. This is not quite correct, as according to the
vendor kernels, msm8976 should use standard slope values (3200), while
msm8956 really uses the slope values found in the driver.
Add separate compatibility string for msm8956, move slope value
overrides to the corresponding init function and use the standard
compute_intercept_slope() function for both platforms.
Fixes: 0e58029017 ("thermal: qcom: tsens-v1: Add support for MSM8956 and MSM8976")
Cc: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-7-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Sasha Levin <sashal@kernel.org>
In order to prevent int340x_thermal_get_trip_type() from possibly
racing with int340x_thermal_read_trips() invoked by int3403_notify()
add locking to it in analogy with int340x_thermal_get_trip_temp().
Fixes: 6757a7abe4 ("thermal: intel: int340x: Protect trip temperature from concurrent updates")
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Trip temperatures are read using ACPI methods and stored in the memory
during zone initializtion and when the firmware sends a notification for
change. This trip temperature is returned when the thermal core calls via
callback get_trip_temp().
But it is possible that while updating the memory copy of the trips when
the firmware sends a notification for change, thermal core is reading the
trip temperature via the callback get_trip_temp(). This may return invalid
trip temperature.
To address this add a mutex to protect the invalid temperature reads in
the callback get_trip_temp() and int340x_thermal_read_trips().
Fixes: 5fbf7f27fa ("Thermal/int340x: Add common thermal zone handler")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 5.0+ <stable@vger.kernel.org> # 5.0+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
put_device() shouldn't be called before a prior call to
device_register(). __thermal_cooling_device_register() doesn't follow
that properly and needs fixing. Also
thermal_cooling_device_destroy_sysfs() is getting called unnecessarily
on few error paths.
Fix all this by placing the calls at the right place.
Based on initial work done by Caleb Connolly.
Fixes: 4748f9687c ("thermal: core: fix some possible name leaks in error paths")
Fixes: c408b3d1d9 ("thermal: Validate new state in cur_state_store()")
Reported-by: Caleb Connolly <caleb.connolly@linaro.org>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Frank Rowand <frowand.list@gmail.com>
Reviewed-by: Yang Yingliang <yangyingliang@huawei.com>
Tested-by: Caleb Connolly <caleb.connolly@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada).
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong).
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi).
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson).
- Convert generic-adc-thermal to DT schema (Rob Herring).
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy).
- Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel).
- Add support for IPQ8074 in the tsens thermal driver along with the DT
bindings (Robert Marko).
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi).
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut).
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle).
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold).
- Add HWMon support for the imx8mm board (Alexander Stein).
- Remove pointless include from the power allocator governor (Christophe
JAILLET).
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski).
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss).
- Demote error log of thermal zone register to debug in the tsens QCom
driver (Manivannan Sadhasivam).
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof).
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar).
- Fix the irq handler return value in the LMh driver (Bjorn Andersson).
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König).
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Merge tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are updates of assorted thermal drivers, mostly for ARM
platforms, generally isolated and fairly straightforward, and the
recent Intel HFI driver fix for systems without HFI support.
Specifics:
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada)
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong)
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi)
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson)
- Convert generic-adc-thermal to DT schema (Rob Herring)
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy)
- Fix memory leak on thermal_of_zone_register() failure (Ido
Schimmel)
- Add support for IPQ8074 in the tsens thermal driver along with the
DT bindings (Robert Marko)
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi)
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut)
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle)
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold)
- Add HWMon support for the imx8mm board (Alexander Stein)
- Remove pointless include from the power allocator governor
(Christophe JAILLET)
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski)
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
- Demote error log of thermal zone register to debug in the tsens
QCom driver (Manivannan Sadhasivam)
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof)
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar)
- Fix the irq handler return value in the LMh driver (Bjorn
Andersson)
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König)"
* tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (35 commits)
thermal/drivers/imx_sc_thermal: Drop empty platform remove function
thermal/drivers/qcom/lmh: Fix irq handler return value
dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
dt-bindings: thermal: k3-j72xx: elaborate on binding description
thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
thermal/drivers/qcom: Demote error log of thermal zone register to debug
thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
thermal/core/power allocator: Remove a useless include
thermal/drivers/imx8mm: Add hwmon support
thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
thermal/drivers/imx: Add support for loading calibration data from OCOTP
...
Weiss)
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi)
- Add the sm8550 QCom compatible string in the DT bindings (Neil
Armstrong)
- Use GENMASK instead of bitmaps and validate the temperature after
reading it (Marcus Folkesson)
- Convert generic-adc-thermal to DT schema (Rob Herring)
- Fix the debug print message where the logic is inverted (Keerthy)
- Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel)
- Add support for IPQ8074 in the tsens driver along with the DT
bindings (Robert Marko)
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi)
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut)
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle)
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold)
- Add the HWMon support on the imx8mm board (Alexander Stein)
- Remove a pointless include in the power allocator governor
(Christophe JAILLET)
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski)
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
- Demote error log of thermal zone register to debug on the tsens QCom
driver (Manivannan Sadhasivam)
- Consolidate the TI Bandgap driver regarding how is handled the efuse
values and the errata handling (Bryan Brattlof)
- Document the Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar)
- Fix the irq handler return value in the LMh driver (Bjorn Andersson)
- Delete platform remove callback as it is empty (Uwe Kleine-König)
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Merge tag 'thermal-v6.2-rc1' of https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal driver changes for 6.2-rc1 from Daniel Lezcano:
"- Add the sm8450 QCom compatible string in the DT bindings (Luca
Weiss)
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi)
- Add the sm8550 QCom compatible string in the DT bindings (Neil
Armstrong)
- Use GENMASK instead of bitmaps and validate the temperature after
reading it (Marcus Folkesson)
- Convert generic-adc-thermal to DT schema (Rob Herring)
- Fix the debug print message where the logic is inverted (Keerthy)
- Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel)
- Add support for IPQ8074 in the tsens driver along with the DT
bindings (Robert Marko)
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi)
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut)
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle)
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold)
- Add the HWMon support on the imx8mm board (Alexander Stein)
- Remove a pointless include in the power allocator governor
(Christophe JAILLET)
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski)
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
- Demote error log of thermal zone register to debug on the tsens QCom
driver (Manivannan Sadhasivam)
- Consolidate the TI Bandgap driver regarding how is handled the efuse
values and the errata handling (Bryan Brattlof)
- Document the Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar)
- Fix the irq handler return value in the LMh driver (Bjorn Andersson)
- Delete platform remove callback as it is empty (Uwe Kleine-König)"
* tag 'thermal-v6.2-rc1' of https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (34 commits)
thermal/drivers/imx_sc_thermal: Drop empty platform remove function
thermal/drivers/qcom/lmh: Fix irq handler return value
dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
dt-bindings: thermal: k3-j72xx: elaborate on binding description
thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
thermal/drivers/qcom: Demote error log of thermal zone register to debug
thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
thermal/core/power allocator: Remove a useless include
thermal/drivers/imx8mm: Add hwmon support
thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
thermal/drivers/imx: Add support for loading calibration data from OCOTP
...
After enough invocations the LMh irq is eventually reported as bad, because the
handler doesn't return IRQ_HANDLED, fix this.
Fixes: 53bca371cd ("thermal/drivers/qcom: Add support for LMh driver")
Reported-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20220316180322.88132-1-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: Minghao Chi <chi.minghao@zte.com.cn>
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202211171409524332954@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Some of TI's J721E SoCs require a software trimming procedure for the
temperature monitors to function properly. To determine if a particular
J721E is not affected by this erratum, both bits in the WKUP_SPARE_FUSE0
region must be set. Other SoCs, not affected by this erratum, will not
need this region.
Map the 'fuse_base' region only when the erratum fix is needed.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-5-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
'fuse_base' is only needed during the initial probe function to provide
data for a software trimming method for some of TI's devices affected by
the i2128 erratum. The devices not affected will not use this region
Remove fuse_base from the main k3_j72xx_bandgap structure
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-4-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Some of TI's J721E SoCs require a software trimming method to report
temperatures accurately. Currently we are using a few different data
types to indicate when we should apply the erratum.
Change the 'workaround_needed' variable's data type to a bool to align
with how we are using this variable currently.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-3-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The k3_thermal_get_temp() function can be simplified to return only
the result of k3_bgp_read_temp() without needing the 'ret' variable
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-2-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
devm_thermal_of_zone_register() can fail with -ENODEV if thermal zone for
the channel is not represented in DT. This is perfectly fine since not all
sensors needs to be used for thermal zones but only a few in real world.
So demote the error log to debug to avoid spamming users.
Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Link: https://lore.kernel.org/r/20221029052933.32421-1-manivannan.sadhasivam@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
On gen2 chips the stage2 threshold is not 140 degC but 125 degC.
Make the warning message clearer by using this variable and also by
including the temperature that was checked for.
Fixes: aa92b3310c ("thermal/drivers/qcom-spmi-temp-alarm: Add support for GEN2 rev 1 PMIC peripherals")
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20221020145237.942146-1-luca.weiss@fairphone.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Drivers should not be logging errors on probe deferral. Switch to using
dev_err_probe() to log failures when parsing the devicetree to avoid
errors like:
qcom-spmi-adc-tm5 c440000.spmi:pmic@0:adc-tm@3400: get dt data failed: -517
when a channel is not yet available.
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Reviewed-by: Manivannan Sadhasivam <mani@kernel.org>
Reviewed-by: Andrew Halaney <ahalaney@redhat.com>
Link: https://lore.kernel.org/r/20221102152630.696-1-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with
calibration values in OCOTP. Add support for reading the OCOTP calibration
data and programming those into the TMU hardware.
The MX8MM/MX8MN TMUv1 uses only one OCOTP cell, while MX8MP TMUv2 uses 4,
the programming differs in each case.
Based on U-Boot commits:
70487ff386c ("imx8mm: Load fuse for TMU TCALIV and TASR")
ebb9aab318b ("imx: load calibration parameters from fuse for i.MX8MP")
Reviewed-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Marek Vasut <marex@denx.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The current tsens debugfs structure is composed by:
- a tsens dir in debugfs with a version file
- a directory for each tsens istance with sensors file to dump all the
sensors value.
This works on the assumption that we have the same version for each
istance but this assumption seems fragile and with more than one tsens
istance results in the version file not tracking each of them.
A better approach is to just create a subdirectory for each tsens
istance and put there version and sensors debugfs file.
Using this new implementation results in less code since debugfs entry
are created only on successful tsens probe.
Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Link: https://lore.kernel.org/r/20221022125657.22530-4-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
For VER_0 the version was incorrectly reported as 0.1.0.
Fix that and correctly report the major version for this old tsens
revision.
Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Link: https://lore.kernel.org/r/20221022125657.22530-3-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Calibrate and tsens_register can fail or PROBE_DEFER. This will cause a
double or a wrong init of the debugfs information. Init debugfs only
with successful probe fixing warning about directory already present.
Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Link: https://lore.kernel.org/r/20221022125657.22530-2-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Qualcomm IPQ8074 uses tsens v2.3 IP, however unlike other tsens v2 IP
it only has one IRQ, that is used for up/low as well as critical.
It also does not support negative trip temperatures.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-4-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
IPQ8074 and IPQ6018 dont support negative trip temperatures and support
up to 204 degrees C as the max trip temperature.
So, instead of always setting the -40 as min and 120 degrees C as max
allow it to be configured as part of the features.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-3-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Despite using tsens v2.3 IP, IPQ8074 and IPQ6018 only have one IRQ for
signaling both up/low and critical trips.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20220818220245.338396-2-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Check against the upper temperature limit (125 degrees C) before
consider the temperature valid.
Fixes: 5eed800a68 ("thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit")
Signed-off-by: Marcus Folkesson <marcus.folkesson@gmail.com>
Reviewed-by: Jacky Bai <ping.bai@nxp.com>
Link: https://lore.kernel.org/r/20221014073507.1594844-1-marcus.folkesson@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
When CPU doesn't support HFI (Hardware Feedback Interface), don't include
BIT 26 in the mask to prevent clearing. otherwise this results in:
unchecked MSR access error: WRMSR to 0x1b1
(tried to write 0x0000000004000aa8)
at rIP: 0xffffffff8b8559fe (throttle_active_work+0xbe/0x1b0)
Fixes: 6fe1e64b60 ("thermal: intel: Prevent accidental clearing of HFI status")
Reported-by: Linus Torvalds <torvalds@linux-foundation.org>
Tested-by: Linus Torvalds <torvalds@linux-foundation.org>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Fix race conditions related to thermal device operations that are not
protected against thermal device removal (Guenter Roeck).
- Fix error code in __thermal_cooling_device_register() (Dan Carpenter).
- Validate new cooling device state (coming from user space) in
cur_state_store() and reuse the max_state value from cooling device
structure in the sysfs interface (Viresh Kumar).
- Fix some possible name leaks in error paths in the thermal control
core code (Yang Yingliang).
- Detect TCC lock bit set in the intel_tcc_cooling driver and make it
refuse to update the TCC offset in that case (Zhang Rui).
- Add TCC cooling support for RaptorLake-S (Zhang Rui).
- Prevent accidental clearing of HFI status by one of the other
drivers using the same status register (Srinivas Pandruvada).
- Protect clearing of thermal status bits in Intel thermal control
drivers (Srinivas Pandruvada).
- Allow the HFI thermal control driver to ACK an HFI event for the
previously observed timestamp (Srinivas Pandruvada).
- Remove a pointless die_id check from the HFI thermal driver and
adjust the definition a data structure used by it (Ricardo Neri).
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Merge tag 'thermal-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These include thermal core fixes to protect thermal device operations
against thermal device removal, other thermal core fixes and updates
of Intel thermal control drivers.
Specifics:
- Fix race conditions related to thermal device operations that are
not protected against thermal device removal (Guenter Roeck)
- Fix error code in __thermal_cooling_device_register() (Dan
Carpenter)
- Validate new cooling device state (coming from user space) in
cur_state_store() and reuse the max_state value from cooling device
structure in the sysfs interface (Viresh Kumar)
- Fix some possible name leaks in error paths in the thermal control
core code (Yang Yingliang)
- Detect TCC lock bit set in the intel_tcc_cooling driver and make it
refuse to update the TCC offset in that case (Zhang Rui)
- Add TCC cooling support for RaptorLake-S (Zhang Rui)
- Prevent accidental clearing of HFI status by one of the other
drivers using the same status register (Srinivas Pandruvada)
- Protect clearing of thermal status bits in Intel thermal control
drivers (Srinivas Pandruvada)
- Allow the HFI thermal control driver to ACK an HFI event for the
previously observed timestamp (Srinivas Pandruvada)
- Remove a pointless die_id check from the HFI thermal driver and
adjust the definition a data structure used by it (Ricardo Neri)"
* tag 'thermal-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: hfi: Remove a pointless die_id check
thermal: core: fix some possible name leaks in error paths
thermal: intel: hfi: ACK HFI for the same timestamp
thermal: intel: Protect clearing of thermal status bits
thermal: intel: Prevent accidental clearing of HFI status
thermal/core: Protect thermal device operations against thermal device removal
thermal/core: Remove thermal_zone_set_trips()
thermal/core: Protect sysfs accesses to thermal operations with thermal zone mutex
thermal/core: Protect hwmon accesses to thermal operations with thermal zone mutex
thermal/core: Introduce locked version of thermal_zone_device_update
thermal/core: Move parameter validation from __thermal_zone_get_temp to thermal_zone_get_temp
thermal/core: Ensure that thermal device is registered in thermal_zone_get_temp
thermal/core: Delete device under thermal device zone lock
thermal/core: Destroy thermal zone device mutex in release function
thermal: intel: intel_tcc_cooling: Add TCC cooling support for RaptorLake-S
thermal: intel: intel_tcc_cooling: Detect TCC lock bit
thermal: intel: hfi: Improve the type of hfi_features::nr_table_pages
thermal/core: fix error code in __thermal_cooling_device_register()
thermal: sysfs: Reuse cdev->max_state
thermal: Validate new state in cur_state_store()
- Update the ACPICA code in the kernel to the 20221020 upstream
version and fix a couple of issues in it:
* Make acpi_ex_load_op() match upstream implementation (Rafael
Wysocki).
* Add support for loong_arch-specific APICs in MADT (Huacai Chen).
* Add support for fixed PCIe wake event (Huacai Chen).
* Add EBDA pointer sanity checks (Vit Kabele).
* Avoid accessing VGA memory when EBDA < 1KiB (Vit Kabele).
* Add CCEL table support to both compiler/disassembler (Kuppuswamy
Sathyanarayanan).
* Add a couple of new UUIDs to the known UUID list (Bob Moore).
* Add support for FFH Opregion special context data (Sudeep Holla).
* Improve warning message for "invalid ACPI name" (Bob Moore).
* Add support for CXL 3.0 structures (CXIMS & RDPAS) in the CEDT
table (Alison Schofield).
* Prepare IORT support for revision E.e (Robin Murphy).
* Finish support for the CDAT table (Bob Moore).
* Fix error code path in acpi_ds_call_control_method() (Rafael
Wysocki).
* Fix use-after-free in acpi_ut_copy_ipackage_to_ipackage() (Li
Zetao).
* Update the version of the ACPICA code in the kernel (Bob Moore).
- Use ZERO_PAGE(0) instead of empty_zero_page in the ACPI device
enumeration code (Giulio Benetti).
- Change the return type of the ACPI driver remove callback to void and
update its users accordingly (Dawei Li).
- Add general support for FFH address space type and implement the low-
level part of it for ARM64 (Sudeep Holla).
- Fix stale comments in the ACPI tables parsing code and make it print
more messages related to MADT (Hanjun Guo, Huacai Chen).
- Replace invocations of generic library functions with more kernel-
specific counterparts in the ACPI sysfs interface (Christophe JAILLET,
Xu Panda).
- Print full name paths of ACPI power resource objects during
enumeration (Kane Chen).
- Eliminate a compiler warning regarding a missing function prototype
in the ACPI power management code (Sudeep Holla).
- Fix and clean up the ACPI processor driver (Rafael Wysocki, Li Zhong,
Colin Ian King, Sudeep Holla).
- Add quirk for the HP Pavilion Gaming 15-cx0041ur to the ACPI EC
driver (Mia Kanashi).
- Add some mew ACPI backlight handling quirks and update some existing
ones (Hans de Goede).
- Make the ACPI backlight driver prefer the native backlight control
over vendor backlight control when possible (Hans de Goede).
- Drop unsetting ACPI APEI driver data on remove (Uwe Kleine-König).
- Use xchg_release() instead of cmpxchg() for updating new GHES cache
slots (Ard Biesheuvel).
- Clean up the ACPI APEI code (Sudeep Holla, Christophe JAILLET, Jay Lu).
- Add new I2C device enumeration quirks for Medion Lifetab S10346 and
Lenovo Yoga Tab 3 Pro (YT3-X90F) (Hans de Goede).
- Make the ACPI battery driver notify user space about adding new
battery hooks and removing the existing ones (Armin Wolf).
- Modify the pfr_update and pfr_telemetry drivers to use ACPI_FREE()
for freeing acpi_object structures to help diagnostics (Wang ShaoBo).
- Make the ACPI fan driver use sysfs_emit_at() in its sysfs interface
code (ye xingchen).
- Fix the _FIF package extraction failure handling in the ACPI fan
driver (Hanjun Guo).
- Fix the PCC mailbox handling error code path (Huisong Li).
- Avoid using PCC Opregions if there is no platform interrupt allocated
for this purpose (Huisong Li).
- Use sysfs_emit() instead of scnprintf() in the ACPI PAD driver and
CPPC library (ye xingchen).
- Fix some kernel-doc issues in the ACPI GSI processing code (Xiongfeng
Wang).
- Fix name memory leak in pnp_alloc_dev() (Yang Yingliang).
- Do not disable PNP devices on suspend when they cannot be re-enabled
on resume (Hans de Goede).
- Clean up the ACPI thermal driver a bit (Rafael Wysocki).
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Merge tag 'acpi-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull ACPI and PNP updates from Rafael Wysocki:
"These include new code (for instance, support for the FFH address
space type and support for new firmware data structures in ACPICA),
some new quirks (mostly related to backlight handling and I2C
enumeration), a number of fixes and a fair amount of cleanups all
over.
Specifics:
- Update the ACPICA code in the kernel to the 20221020 upstream
version and fix a couple of issues in it:
- Make acpi_ex_load_op() match upstream implementation (Rafael
Wysocki)
- Add support for loong_arch-specific APICs in MADT (Huacai Chen)
- Add support for fixed PCIe wake event (Huacai Chen)
- Add EBDA pointer sanity checks (Vit Kabele)
- Avoid accessing VGA memory when EBDA < 1KiB (Vit Kabele)
- Add CCEL table support to both compiler/disassembler (Kuppuswamy
Sathyanarayanan)
- Add a couple of new UUIDs to the known UUID list (Bob Moore)
- Add support for FFH Opregion special context data (Sudeep
Holla)
- Improve warning message for "invalid ACPI name" (Bob Moore)
- Add support for CXL 3.0 structures (CXIMS & RDPAS) in the CEDT
table (Alison Schofield)
- Prepare IORT support for revision E.e (Robin Murphy)
- Finish support for the CDAT table (Bob Moore)
- Fix error code path in acpi_ds_call_control_method() (Rafael
Wysocki)
- Fix use-after-free in acpi_ut_copy_ipackage_to_ipackage() (Li
Zetao)
- Update the version of the ACPICA code in the kernel (Bob Moore)
- Use ZERO_PAGE(0) instead of empty_zero_page in the ACPI device
enumeration code (Giulio Benetti)
- Change the return type of the ACPI driver remove callback to void
and update its users accordingly (Dawei Li)
- Add general support for FFH address space type and implement the
low- level part of it for ARM64 (Sudeep Holla)
- Fix stale comments in the ACPI tables parsing code and make it
print more messages related to MADT (Hanjun Guo, Huacai Chen)
- Replace invocations of generic library functions with more kernel-
specific counterparts in the ACPI sysfs interface (Christophe
JAILLET, Xu Panda)
- Print full name paths of ACPI power resource objects during
enumeration (Kane Chen)
- Eliminate a compiler warning regarding a missing function prototype
in the ACPI power management code (Sudeep Holla)
- Fix and clean up the ACPI processor driver (Rafael Wysocki, Li
Zhong, Colin Ian King, Sudeep Holla)
- Add quirk for the HP Pavilion Gaming 15-cx0041ur to the ACPI EC
driver (Mia Kanashi)
- Add some mew ACPI backlight handling quirks and update some
existing ones (Hans de Goede)
- Make the ACPI backlight driver prefer the native backlight control
over vendor backlight control when possible (Hans de Goede)
- Drop unsetting ACPI APEI driver data on remove (Uwe Kleine-König)
- Use xchg_release() instead of cmpxchg() for updating new GHES cache
slots (Ard Biesheuvel)
- Clean up the ACPI APEI code (Sudeep Holla, Christophe JAILLET, Jay
Lu)
- Add new I2C device enumeration quirks for Medion Lifetab S10346 and
Lenovo Yoga Tab 3 Pro (YT3-X90F) (Hans de Goede)
- Make the ACPI battery driver notify user space about adding new
battery hooks and removing the existing ones (Armin Wolf)
- Modify the pfr_update and pfr_telemetry drivers to use ACPI_FREE()
for freeing acpi_object structures to help diagnostics (Wang
ShaoBo)
- Make the ACPI fan driver use sysfs_emit_at() in its sysfs interface
code (ye xingchen)
- Fix the _FIF package extraction failure handling in the ACPI fan
driver (Hanjun Guo)
- Fix the PCC mailbox handling error code path (Huisong Li)
- Avoid using PCC Opregions if there is no platform interrupt
allocated for this purpose (Huisong Li)
- Use sysfs_emit() instead of scnprintf() in the ACPI PAD driver and
CPPC library (ye xingchen)
- Fix some kernel-doc issues in the ACPI GSI processing code
(Xiongfeng Wang)
- Fix name memory leak in pnp_alloc_dev() (Yang Yingliang)
- Do not disable PNP devices on suspend when they cannot be
re-enabled on resume (Hans de Goede)
- Clean up the ACPI thermal driver a bit (Rafael Wysocki)"
* tag 'acpi-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (67 commits)
ACPI: x86: Add skip i2c clients quirk for Medion Lifetab S10346
ACPI: APEI: EINJ: Refactor available_error_type_show()
ACPI: APEI: EINJ: Fix formatting errors
ACPI: processor: perflib: Adjust acpi_processor_notify_smm() return value
ACPI: processor: perflib: Rearrange acpi_processor_notify_smm()
ACPI: processor: perflib: Rearrange unregistration routine
ACPI: processor: perflib: Drop redundant parentheses
ACPI: processor: perflib: Adjust white space
ACPI: processor: idle: Drop unnecessary statements and parens
ACPI: thermal: Adjust critical.flags.valid check
ACPI: fan: Convert to use sysfs_emit_at() API
ACPICA: Fix use-after-free in acpi_ut_copy_ipackage_to_ipackage()
ACPI: battery: Call power_supply_changed() when adding hooks
ACPI: use sysfs_emit() instead of scnprintf()
ACPI: x86: Add skip i2c clients quirk for Lenovo Yoga Tab 3 Pro (YT3-X90F)
ACPI: APEI: Remove a useless include
PNP: Do not disable devices on suspend when they cannot be re-enabled on resume
ACPI: processor: Silence missing prototype warnings
ACPI: processor_idle: Silence missing prototype warnings
ACPI: PM: Silence missing prototype warning
...
Merge one more Intel thermal control change for 6.2-rc1:
- Remove a pointless die_id chec from the Intel HFI thermal control
driver (Ricardo Neri).
* thermal-intel:
thermal: intel: hfi: Remove a pointless die_id check
die_id is an u16 quantity. On single-die systems the default value of
die_id is 0. No need to check for negative values.
Plus, removing this check makes Coverity happy.
Signed-off-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Add Raptor Lake-S support to the intel_tcc_cooling driver (Zhang
Rui).
- Make the intel_tcc_cooling driver detect TCC locking (Zhang Rui).
- Address Coverity warning in intel_hfi_process_event() (Ricardo Neri).
- Prevent accidental clearing of HFI in the package thermal interrupt
status (Srinivas Pandruvada).
- Protect the clearing of status bits in MSR_IA32_PACKAGE_THERM_STATUS
and MSR_IA32_THERM_STATUS (Srinivas Pandruvada).
- Allow the HFI interrupt handler to ACK an event for the same
timestamp (Srinivas Pandruvada).
* thermal-intel:
thermal: intel: hfi: ACK HFI for the same timestamp
thermal: intel: Protect clearing of thermal status bits
thermal: intel: Prevent accidental clearing of HFI status
thermal: intel: intel_tcc_cooling: Add TCC cooling support for RaptorLake-S
thermal: intel: intel_tcc_cooling: Detect TCC lock bit
thermal: intel: hfi: Improve the type of hfi_features::nr_table_pages
In some error paths before device_register(), the names allocated
by dev_set_name() are not freed. Move dev_set_name() front to
device_register(), so the name can be freed while calling
put_device().
Fixes: 1dd7128b83 ("thermal/core: Fix null pointer dereference in thermal_release()")
Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some processors issue more than one HFI interrupt with the same
timestamp. Each interrupt must be acknowledged to let the hardware issue
new HFI interrupts. But this can't be done without some additional flow
modification in the existing interrupt handling.
For background, the HFI interrupt is a package level thermal interrupt
delivered via a LVT. This LVT is common for both the CPU and package
level interrupts. Hence, all CPUs receive the HFI interrupts. But only
one CPU should process interrupt and others simply exit by issuing EOI
to LAPIC.
The current HFI interrupt processing flow:
1. Receive Thermal interrupt
2. Check if there is an active HFI status in MSR_IA32_THERM_STATUS
3. Try and get spinlock, one CPU will enter spinlock and others
will simply return from here to issue EOI.
(Let's assume CPU 4 is processing interrupt)
4. Check the stored time-stamp from the HFI memory time-stamp
5. if same
6. ignore interrupt, unlock and return
7. Copy the HFI message to local buffer
8. unlock spinlock
9. ACK HFI interrupt
10. Queue the message for processing in a work-queue
It is tempting to simply acknowledge all the interrupts even if they
have the same timestamp. This may cause some interrupts to not be
processed.
Let's say CPU5 is slightly late and reaches step 4 while CPU4 is
between steps 8 and 9.
Currently we simply ignore interrupts with the same timestamp. No
issue here for CPU5. When CPU4 acknowledges the interrupt, the next
HFI interrupt can be delivered.
If we acknowledge interrupts with the same timestamp (at step 6), there
is a race condition. Under the same scenario, CPU 5 will acknowledge
the HFI interrupt. This lets hardware generate another HFI interrupt,
before CPU 4 start executing step 9. Once CPU 4 complete step 9, it
will acknowledge the newly arrived HFI interrupt, without actually
processing it.
Acknowledge the interrupt when holding the spinlock. This avoids
contention of the interrupt acknowledgment.
Updated flow:
1. Receive HFI Thermal interrupt
2. Check if there is an active HFI status in MSR_IA32_THERM_STATUS
3. Try and get spin-lock
Let's assume CPU 4 is processing interrupt
4.1 Read MSR_IA32_PACKAGE_THERM_STATUS and check HFI status bit
4.2 If hfi status is 0
4.3 unlock spinlock
4.4 return
4.5 Check the stored time-stamp from the HFI memory time-stamp
5. if same
6.1 ACK HFI Interrupt,
6.2 unlock spinlock
6.3 return
7. Copy the HFI message to local buffer
8. ACK HFI interrupt
9. unlock spinlock
10. Queue the message for processing in a work-queue
To avoid taking the lock unnecessarily, intel_hfi_process_event() checks
the status of the HFI interrupt before taking the lock. If CPU5 is late,
when it starts processing the interrupt there are two scenarios:
a) CPU4 acknowledged the HFI interrupt before CPU5 read
MSR_IA32_THERM_STATUS. CPU5 exits.
b) CPU5 reads MSR_IA32_THERM_STATUS before CPU4 has acknowledged the
interrupt. CPU5 will take the lock if CPU4 has released it. It then
re-reads MSR_IA32_THERM_STATUS. If there is not a new interrupt,
the HFI status bit is clear and CPU5 exits. If a new HFI interrupt
was generated it will find that the status bit is set and it will
continue to process the interrupt. In this case even if timestamp
is not changed, the ACK can be issued as this is a new interrupt.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Tested-by: Arshad, Adeel<adeel.arshad@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The clearing of the package thermal status is done by Read-Modify-Write
operation. This may result in clearing of some new status bits which are
being or about to be processed.
For example, while clearing of HFI status, after read of thermal status
register, a new thermal status bit is set by the hardware. But during
write back, the newly generated status bit will be set to 0 or cleared.
So, it is not safe to do read-modify-write.
Since thermal status Read-Write bits can be set to only 0 not 1, it is
safe to set all other bits to 1 which are not getting cleared.
Create a common interface for clearing package thermal status bits. Use
this interface to replace existing code to clear thermal package status
bits.
It is safe to call from different CPUs without protection as there is no
read-modify-write. Also wrmsrl results in just single instruction. For
example while CPU 0 and CPU 3 are clearing bit 1 and 3 respectively. If
CPU 3 wins the race, it will write 0x4000aa2, then CPU 1 will write
0x4000aa8. The bits which are not part of clear are set to 1. The default
mask for bits, which can be written here is 0x4000aaa.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
