[ Upstream commit ffbe2feac5 ]
Probe for omap2430 glue layer is now broken for interrupt resources in
all cases.
Commit 2390710647 ("partially Revert "usb: musb: Set the DT node on the
child device"") broke probing for SoCs using ti-sysc interconnect target
module as the dt node is not found.
Commit a1a2b7125e ("of/platform: Drop static setup of IRQ resource from
DT core") caused omap3 to fail with error "-ENXIO: IRQ mc not found" as
the IRQ resources are no longer automatically populated from devicetree.
Let's fix the issues by calling device_set_of_node_from_dev() only if the
SoC has been updated to probe with ti-sysc. And for legacy SoCs, let's
populate the resources manually as needed.
Note that once we have updated the SoCs to probe with proper devicetree
data in all cases, this is no longer needed. But doing that requires
patching both devicetree and SoC code, so let's fix the probe issues first.
Fixes: a1a2b7125e ("of/platform: Drop static setup of IRQ resource from DT core")
Fixes: 2390710647 ("partially Revert "usb: musb: Set the DT node on the child device"")
Cc: H. Nikolaus Schaller <hns@goldelico.com>
Reported-by: Sicelo Mhlongo <absicsz@gmail.com>
Tested-by: Sicelo Mhlongo <absicsz@gmail.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
Link: https://lore.kernel.org/r/20221118102532.34458-1-tony@atomide.com
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Signed-off-by: Sasha Levin <sashal@kernel.org>
22b60658a9