thermal/x86_pkg_temp_thermal: Support multi-die/package

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Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.

Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com

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Zhang Rui 2019-05-13 13:58:52 -04:00 • committed by Thomas Gleixner

parent 32fb480e0a

commit 724adec33c

1 changed files with 4 additions and 4 deletions

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drivers/thermal/intel/x86_pkg_temp_thermal.c

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