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724adec33c
Package temperature sensors are actually implemented in hardware per-die. Thus, the new multi-die/package systems sport mulitple package thermal zones for each package. Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose multiple zones per package, instead of just one. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com> Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Ingo Molnar <mingo@kernel.org> Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org> Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com |
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| kernel | ||
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| README | ||
Linux kernel
============
There are several guides for kernel developers and users. These guides can
be rendered in a number of formats, like HTML and PDF. Please read
Documentation/admin-guide/README.rst first.
In order to build the documentation, use ``make htmldocs`` or
``make pdfdocs``. The formatted documentation can also be read online at:
https://www.kernel.org/doc/html/latest/
There are various text files in the Documentation/ subdirectory,
several of them using the Restructured Text markup notation.
Please read the Documentation/process/changes.rst file, as it contains the
requirements for building and running the kernel, and information about
the problems which may result by upgrading your kernel.