usb: musb: make davinci and da8xx glues depend on BROKEN

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those two glues are still including <mach/>
headers and no active developement has been
going on those glues for quite some time.

Apparently, for da8xx glue, only initial commit
3ee076de (usb: musb: introduce DA8xx/OMAP-L1x
glue layer) has been tested. All other patches
seem to have been compile-tested only.

For davinci glue layer, last real commit dates
back from 2010, with commit f405387 (USB: MUSB:
fix kernel WARNING/oops when unloading module
in OTG mode).

Signed-off-by: Felipe Balbi <balbi@ti.com>

...

This commit is contained in:

Felipe Balbi 2013-02-06 09:24:55 +02:00

parent 99b7856f3c

commit 787f5627be

1 changed files with 2 additions and 0 deletions

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drivers/usb/musb/Kconfig

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